SESDL5V0WB Datasheet, PDF (1/2 Pages) WILLAS ELECTRONIC CORP – Transient Voltage Suppressors for ESD Protection

WILLAS
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SOD-123+ PACKAGE
FM120-M+
SESDL5V0W_THB_RU
FM1200-M+
Pb Free Product
Features
Package outline
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
DESCRIP^oT^pI^tiO^mN^{ize board space.}
The
6^•• E_HLoS_igwD_hpc/^ou5^wrV_ree0^rnl:_tocsa%^sp,_ahi^ibs^gihld_iteye_,fs^flioi^cg_wien_fne_ocrd^yw. t_ao_rdp_vr_oo_ltt_ae_gc_et
voltage
drop.
sensitive
compon•eHntigshfsrourmgeEcSapDa.biElitxyc. ellent clamping capability, low leakage,
SOD-123H
WBFBP-02C
(1.0×0.6×0.5) 0.146(3.7)
unit: mm
0.130(3.3)
0.012(0.3) Typ.
and fast^•r^Ge^us^ap^ro^dn^risⁿe^{g f}t^oim^{r o}e^vep^rvro^olv^taid^ge^{e p}b^re^ots^et^ci^tn^ionc^.lass protection on designs that
• Ultra high-speed switching.
are expo_•s_Se_ild_icoto_{n e}E_pS_itaD_x._iaB_{l p}e_lc_aa_nau_rs_ce_hio_pf_{, m}its_ets_alm_sia_lil_cl_os_niz_jue_n,_ci_tt_ioi_ns_. suited for use in
0.071(1.8)
0.056(1.4)
cellular p^• h^Leo^an^de^-s^fr,^eeM^pP^a3^rtsp^mla^ey^ee^t r^esⁿ,^vid^roigⁿi^mta^elⁿc^taa^lm^ste^anra^das^rda^sn^od^f many other portable
MIL-STD-19500 /228
applicati_•o_Rn_os_Hw_S h_pre_or_de_ucb_{t f}o_oa_{r p}rd_acks_ip_nga_cc_oe_deis_sua_fft_ixa_"Gp_"remium.
Halogen free product for packing code suffix "H"
FEATUR^ME^eS^{chanical data}
z Sta^•n^Ed^p−^oo^xyff^:V^Uo^L9lt⁴a^-g^Ve⁰:^ra5^t.^e0^d V^{flame retardant}
z Low^{• C}L^ae^sa^ek^: a^Mg^oe^{lded plastic, SOD-123H}
,
z
• Terminals :Plated terminals, solderable per MIL-STD-750
Response Time is Typically < 1 ns
Method 2026
z ES_•D_PR_olaa_rt_ii_tn_yg_{: I}o_ndf _iC_cala_tes_ds_by3_c(_a>_th1_o6_dek_bV_a)_ndPer Human Body Model
z IEC• 6M1o0u0nt0in−g4P−o2siLtieonve: Al n4yESD Protection
0.031(0.8) Typ.
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
Dimensions in inches and (millimeters)
z IEC• 6W1e0ig0h0t−: A4p−p4roLxeimvaetle4d 0E.0F1T1 gPraromtection
zz_RatiP^T_ngb^h_s-^is_Fatrⁱ_e^s_25e^a_℃p^P_a^M_a^b_cm^A−_kb^X_a^F_ieg^IrM_n^e_et^eU_ties^M_m^D_ap^eR_ve^v_ra^A_aⁱ_i^c_tl^T_u^e_ar^I_eb^N_lu^G_enl^S_es^A_{s o}^N_th^D_er^E_w^L_is^E_e ^C_sp^T_e^R_cif^I_ie^C_d^A_. ^{L CHARACTERISTICS}
Sing^Rle^op^Hh^Sas^pe^rh^oa^dlf^uw^ca^t v^fe^o,^r6^p0^aH^cz^k, ⁱrⁿes^gis^cti^ove^deof^sin^ud^fu^fic^xtiv^”Ge l^”oad.
ForHcaaploacgiteivne flroeaed, pdreoradtueccturfroernpt bayck20in%g code suffix “H”
RATINGS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH U
Marking Code
12
13
14
15
16
18
10
115 120
Maximum Recurrent Peak Reverse Voltage
Ma_Mx_ai_xm_imu_umm_RMR_Sa_Vti_on_ltg_ags_e @Ta=25℃
VRRM
20
30
40
50
60
VRMS
14
21
28
35
42
80
100
150
200 V
56
70
105
140 ^V
Maximum DC Blocking Voltage
VDC
20
Maximum Average Forward Rectified^PC^au^rr^are^mnt ^eter
IO
IEC61000−4−2(ESD)
Peak Forward Surge Current 8.3 ms single half sine-wave _IFSM
superimposed on rated load (JEDEC method)
30
40
50
Symbol
Air
Contact
60
80
Limit
1.0
±30
30_±30
100
Unit
KV
150
200 ^V
A
A
E^TS^yD^picaV^{l T}o^hl^eta^rmg^ae^{l Resistance (Note 2)}
Pe^Rr ^ΘH^JAuman Body Model
40 ₁₆
KV
℃
Typical Junction Capacitance (Note 1)
Operating Temperature Range
P^CJer
TJ
Machine_-5M_{5 t}o_od₊e₁l₂₅
120₄₀₀
V
-55 to +150
ToSttoarlagPeoTwemepreDratiusrseiRpaantgioe n on FR-5 Board (NoTSteTG1)
P_D
- 65 to1+01075
mW
Thermal Resista_Cn_Hc_Ae_RAJ_Cu_Tn_Ec_Rt_Ii_So_Tn_IC−_Sto−Ambien_St _YMBOL R _{FM120-MH FM130-MH FM140-MH FM1Θ5J0A-MH FM160-MH}1_F2_M5₁0_{80-MH FM1}℃₁₀/₀W_{-MH FM1150-MH FM1200-MH U}
Maximum Forward Voltage at 1.0A DC
VF
0.50
Le_Ma_axd_imS_umol_Ad_ve_er_raT_gee_Rm_evp_ee_rsr_ea_Ctu_urr_re_en−_{t a}M_{t @}ax_Ti_Am₌₂u₅m_℃
(10
Second
IR
Duration)
Ju^Rn^atc^edtio^Dn^{C B}a^lon^cd^kinS^gt^Vo^or^la^tag^gee Tempera^@tu^Tr^Ae⁼¹R²⁵a^℃nge
0.70
0.85
0.9
T_L
0.5 ²⁶⁰
℃
T_j, T_stg
-¹5⁰5 ~ +150
℃
0.92 V
m
Str^Ne^Os^Ts^Ee^Ss^: exceeding maximum ratings may damage the device. Maximum Ratings are stress ratings only.
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
Functional operation above the recommended. Operating conditions is not implied. Extended exposure to
2- Thermal Resistance From Junction to Ambient
stresses above the recommended operating conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
2012-06
2012-09
WILLAS ELECTRONIC CORP
WILLAS ELECTRONIC CORP.