SEMF3V3LC Datasheet, PDF (1/3 Pages) WILLAS ELECTRONIC CORP – Low Capacitance Quad Array for ESD Protection Description

WILLAS
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SOD-123+ PACKAGE
SEMF^F3^MV3_TL¹C_H²_R⁰_U^-M+
FM1200-M+
Pb Free Product
Features
Package outline
• Batch process design, excellent power dissipation offers
Gen_•e_Lbr_oea_wttl^epD^rrroee_fvis_leec^rssr_uei_rlp_feaat_ci^keo^amgn_{oeucnutrerdenatpapnlidcathtieornmianlorredseisrttaonce}F^. eatures
SOD-123H
Th^oi^ps^timinⁱt^ze^eg^br^oa^ate^rdd^sptr^aa^cn^es^. ient voltage suppressor z Four Separate Unidirectional Configurations for
• Low power loss, high efficiency.
devic_•e_H(_iT_ghV_cS_u)_rris_end_t e_cs_ai_pg_an_be_ild_ityf_,o_lor_wap_fop_rwlic_aa_rdtio_von_ls_tar_ge_eq_du_ri_or_pin_. g
Protection
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
trans^•ie^Hnⁱt^go^h v^se^ur^rgv^eol^cta^apg^ae^bp^ilir^to^y.tection, printers, business z Low Leakage Current < 1 μA @ 3Volts
mach^•in^Ge^us^a,^rdrinc^gom^fom^{r o}u^vn^eric^va^olt^ti^ao^gn^{e pr}s^oy^tes^ct^te^iomⁿs^. , medical z
• Ultra high-speed switching.
equip_•m_Se_ilin_ct_o,_na_en_pd_itao_xit_ah_le_pr_laa_nap_rp_cli_hc_ia_p,ti_mon_es_ta._{l s}It_is_licoin_nte_jug_nr_ca_tit_oe_nd_. z
Power Dissipation: 380mW
Small SOT-353 SMT Package
0.071(1.8)
0.056(1.4)
desig^•n^Leap^dr^-o^frv^ei^ede^ps^artsv^me^ery^{et en}e^vff^ire^ocⁿt^miv^ee^ntaa^{l s}n^td^andare^rdli^sa^ob^fle z Low Capacitance
MIL-STD-19500 /228
prote_•cRtioHnS pfororducstefoprapraactkeinglcinoedessuuffisxin"Gg" only one z Complies to USB 1.1 Low Speed & Speed
packag^He^a.^logT^ehⁿe^frs^ee^{e p}d^roe^dv^ui^cc^te^fos^{r p}a^ar^ce^kini^gde^coa^dl^ef^so^ur^ffixsi^"t^Hu^"ations
Specifications
Mechanical data
where board space is at a premium.
z These are Pb-Free Devices
0.040(1.0)
• Epoxy : UL94-V0 rated flame retardant
z Pb-Free package is available
0.024(0.6)
• Case : Molded plastic, SOD-123H
Applications
, RoHS pro⁰d^.0u³¹c⁽⁰t^.8f⁾o^Tyr^p.packing code suffix ”G” ^{0.031(0.8) Typ.}
• Terminals :Plated terminals, solderable per MIL-STD-750
z Serial and P_Ma_er_ta_hl_ole_dl₂P₀₂o₆rts
Halogen free product for packing code suffix “H”
z M• Picorloapritryo:cIensdsicoarteBdabsyecdatEhqodueipbmanednt
z N• MotoeubnotionkgsP,oDsietisoknt:oApnsy, Servers
z C^{• W}el^elu^igla^hr^{t :}a^An^pd^prP^oo^xir^mta^ab^tele^d E^0.q⁰u¹¹ip^gm^rae^mnt
Complies with the f^Do^imll^eo^nsw^ioni^snⁱⁿgⁱⁿs^cht^ea^sn^and^da^(mrⁱd^llims^eters)
IEC61000-4-2
Level 4 15 kV (air discharge)
Marking ^{MAXIMUM RATINGS AND ELECTRICAL CHARAC8TkEVR(IcSoTnItCaSct discharge)}
Ratings at 25℃ ambient temperature unless otherwise specified. _{MIL STD 883E - Method 3015-7 Class 3}
Sin_Tg_yle_pp_eh_nas_ue_mha_bl_ef w_r ave, 60Hz, resistive _Mof_ain_rd_ku_ic_nti_gve_cl_ooa_dd_e.
25 kV HBM (Human Body Model)
For capacitive load, derate current by 20%
SEMF3V3LC
VB
RATINGS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
M_Fark_uin_ng _cCo_td_ioe _{nal diagram}
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
12
13
14
15
16
VRRM
20
30
40
50
60
VRMS
14
21
28
35
42
VDC
20
30
40
50
60
18
10
115 120
80
100
150
200
56
70
105
140 ^V
80
100
150
200 ^V
Maximum Average Forward Rectified Current
IO
1.0
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
Typical Thermal Resistance (Note 2)
Typical Junction Capacitance (Note 1)
Operating Temperature Range
Storage Temperature Range
SOT-353
IFSM
RΘJA
CJ
TJ
TSTG
-55 to +125
30
40
120
- 65 to +175
-55 to +150
Maximum R_CHa_At_Rin_ACg_Ts_ER(_IST_TAIC=_S25°C)
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
Maxi_Sm_yum_mF_bo_orw_lard Voltage at 1.0A DC
P^Va^F rameter
0.50
0.70
Value^0.85 Units^0.9
0.92
RMaatxeidmDu^{PmCPABKvloecrkaigneg}
R_Pev_ee_ars_ke
Voltage
P^Cuo^rw^rene^tr^aD^t i^@ss^Tip^A=a²t⁵io^℃n(8×2^I0^Rμs@TA=25℃)
@T A=125℃
P_D
Steady State Power-1 Diode
NOTES:
1-
2-
MTheearsm_Ruar_θel d_{JRAeast i1stManHcZe}^TaF_An^h_rodbemaorpJ^mvpul_en^aiecd^l_t2io^Rr₅env^e_℃teo^srsA_,^isem^tv_Db^aoi_eeⁿltna_r^c_tga^ee_t^,o_ef^J4^u.0ⁿV^cD^tiC^o.^n-to-Ambient
0.5 ₃₀
W
m
10
380
mW
327
℃/W
3.05
Mw/℃
T_Jmax
Maximum Junction Temperature
150
℃
T_J T_stg Operation Junction and Storage Temperature Range
-55 to +150
℃
T_L
Lead Solder Temperature(10 seconds duration)
260
℃
2012-0012-06
WILLAS EWLEILCLTARSOENLIECCCTORROPN.IC CORP