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WCMC2016V1X Datasheet, PDF (3/5 Pages) Weida Semiconductor, Inc. – 128K x 16 Pseudo Static RAM DIE
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ADVANCE INFORMATION
All units in µm. (0,0) is the lower Left hand corner of the die.
Bond Pad Coordinates and Signal Descriptions
ID Pad Name
Pad Function Description
1 A15
2 TEST1
3 A14
4 TEST2
5 A13
6 A12
7 A11
8 A10
9 A9
10 A8
11 TEST3
11 TEST4
12 WE
13 CE2
14 VCC
15 VCC
16 VSS
17 VSS
18 UBE
19 LBE
20 TEST5
20 TEST6
20 TEST7
21 A17
22 A7
23 A6
24 A5
25 A4
26 A3
27 A2
28 A1
29 A16
30 VSS
31 VCC
32 I/O15
33 I/O7
34 I/O14
35 I/O6
ADDR
DNU
ADDR
DNU
ADDR
ADDR
ADDR
ADDR
ADDR
ADDR
DNU
DNU
WE
CE2
VCC
VCC
GND
GND
BHE
BLE
DNU
DNU
DNU
ADDR
ADDR
ADDR
ADDR
ADDR
ADDR
ADDR
ADDR
ADDR
GND
VCC
DQ15
DQ7
DQ14
DQ6
Address
Do Not Use
Address
Do Not Use
Address
Address
Address
Address
Address
Address
Do Not Use
Do Not Use
Write Enable/Select Bar
Chip Enable/Select 2
Power Supply (Core)
Power Supply (Core)
Ground (also VSS)
Ground (also VSS)
Byte (High) Enable/Select Bar
Byte (Low) Enable/Select Bar
Do Not Use
Do Not Use
Do Not Use
Address
Address
Address
Address
Address
Address
Address
Address
Address
Ground
Power Supply (Core)
Bi-directional Data
Input/Output 15
Bi-directional Data
Input/Output 7
Bi-directional Data
Input/Output 14
Bi-directional Data
Input/Output 6
WCMC2016V1X
X Coord
[µm]
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
98.31
1467.54
1467.54
1467.54
1467.54
1467.54
1467.54
1467.54
Y Coord
[µm]
3950.48
3851.12
3751.76
3652.40
3553.04
3453.68
3354.32
3254.96
3155.60
3056.24
2956.88
2857.52
2758.16
2658.80
2559.44
2460.08
2261.36
2201.66
2261.36
2162.00
2062.64
1963.28
1863.92
1764.56
1665.20
1565.84
1466.48
1367.12
1267.76
1168.40
1069.04
3909.67
3810.31
3710.95
3611.59
3484.95
3358.31
3231.67
38-xyxyx
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