W3DG648V-D1 Datasheet, PDF (5/6 Pages) White Electronic Designs Corporation – 64MB - 2x4Mx64 SDRAM, UNBUFFERED

White Electronic Designs
W3DG648V-D1
PACKAGE DIMENSIONS FOR D1
Ordering Information
Speed
CAS Latency
Height*
W3DG648V10D1
100MHz
CL=2
27.94 (1.100”)
W3DG648V7D1
133MHz
CL=2
27.94 (1.100”)
W3DG648V75D1
133MHz
CL=3
27.94 (1.100”)
NOTES:
• Consult Factory for availability of RoHS compliant products. (G = RoHS Compliant)
• Vendor specific part numbers are used to provide memory components source control. The place holder for this is
shown as lower case “x” in the part numbers above and is to be replaced with the respective vendors code. Consult
factory for qualified sourcing options.
(M = Micron, S = Samsung & consult factory for others)
• Consult factory for availability of industrial temperature (-40°C to 85°C) option
PACKAGE DIMENSIONS FOR D1
2.01 (0.079 Min)
67.72
(2.661 Max)
4.32
(0.170)
MAX.
3.99
(0.157)
23.14
(0.913)
28.2
(1.112)
32.79
(1.291)
4.60 (0.181)
1.50 (0.059)
19.99
(0.787)
27.94
(1.100)
Max
* All Dimensions are in millimeters and (inches).
0.99 ± 0.10
(0.039)
(± 0.004)
July 2005
Rev. 6
5
White Electronic Designs Corporation • [phone] • www.wedc.com