W3H32M64E-XSBX Datasheet, PDF (4/6 Pages) White Electronic Designs Corporation – 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package

White Electronic Designs
W3H32M64E-XSBX
ADVANCED
PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA)
208 x Ø 0.60 (0.024) NOM
BOTTOM VIEW
11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1.0 (0.039)NOM
10.0 (0.394) NOM
16.15 (0.636) MAX
0.50
(0.020)
NOM
2.56 (0.100) MAX
All linear dimensions are millimeters and parenthetically in inches
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October 2005
Rev. 3
4
White Electronic Designs Corporation • [phone] • www.wedc.com