W3E16M72S-XBX Datasheet, PDF (17/17 Pages) White Electronic Designs Corporation – 16Mx72 DDR SDRAM

White Electronic Designs
W3E16M72S-XBX
Document Title
16M x 72 DDR SDRAM Multi-Chip Package
Revision History
Rev # History
Rev 0 Initial Release
Rev 1
Rev 2
Changes (Pg. 1, 10)
1.1 Add Currents to data sheet in place of TBD
Changes (Pg. 1, 8, 9, 10, 11, 12)
2.1 Change product status from Advanced to Preliminary
Rev 3
Changes (Pg. 1, 10, 14, 15, 16)
3.1 Change ICCI to 825 mA @ 250/266 MHz
3.2 Change ICC1 to 775 mA @ 200 MHz
3.3 Change ICC4R to 1250 mA @ 250/266 MHz
3.4 Change ICC4R to 1075 mA @ 200 MHz
3.5 Change ICC4W to 1250 mA @ 250/266 MHz
3.6 Change ICC4W to 1075 mA @ 200 MHz
3.7 Change ICC6A to ICC6
3.8 Change ICC8 to ICC7
3.9 Change ICC7 to 2000 mA @ 250/266 MHz
3.10 Change ICC7 to 1875 mA @ 200 MHz
3.11 Add Thermal Resistance Table
Rev 4
Changes (Pg. 1, 14, 15)
4.1 Change mechanical drawing to new style
4.2 Change part number to new style
Rev 5
Changes (Pg. 1, 10, 11, 12, 14, 15)
5.1 Change TREF from 70.3µs max to 35µs max for Military
temperature only
5.2 Change TREFI from 7.8µs max to 3.9µs max for Military
temperature only
5.3 Change Thermal Resistance Table ΘJC, ΘJB, ΘJA
5.4 Add Note 53 for VTT, pg. 14
Rev 6
Changes (Pg. 1, 10, 11, 12, 13, 16, 17)
6.1 Change status to Final
6.2 Correct typographical errors
Rev 7
Changes (Pg. 1, 11, 17)
7.1 Update ICC Specifications table
Release Date Status
April 2002
Advanced
September 2002 Advanced
November 2002 Preliminary
December 2002 Preliminary
November 2003 Preliminary
April 2004
Preliminary
September 2004 Final
February 2005
Final
February 2005
Rev. 7
17
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