W3E16M72S-XBX Datasheet, PDF (10/17 Pages) White Electronic Designs Corporation – 16Mx72 DDR SDRAM

White Electronic Designs
W3E16M72S-XBX
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on VCC, VCCQ Supply relative to Vss
Voltage on I/O pins relative to VSS
Operating Temperature TA (Mil)
Operating Temperature TA (Ind)
Storage Temperature, Plastic
Unit
-1 to 3.6
V
-1 to 3.6
V
-55 to +125 °C
-40 to +85 °C
-55 to +150 °C
NOTE:
Stress greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions greater than those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
CAPACITANCE (NOTE 13)
Parameter
Input Capacitance: CLK
Addresses, BA0-1 Input Capacitance
Input Capacitance: All other input-only pins
Input/Output Capacitance: I/Os
Symbol Max Unit
CI1
8
pF
CA
30
pF
CI2
9
pF
CIO
12
pF
BGA THERMAL RESISTANCE
Description
Junction to Ambient (No Airflow)
Junction to Ball
Junction to Case (Top)
Symbol Max Units Notes
Theta JA 13.7 °C/W 1
Theta JB 10.3 °C/W 1
Theta JC 3.9 °C/W 1
Note 1: Refer to PBGA Thermal Resistance Correllation application note at
www.wedc.com in the application notes section for modeling conditions.
February 2005
Rev. 7
10
White Electronic Designs Corporation • [phone] • www.wedc.com