W3E32M72S-XBX Datasheet, PDF (10/19 Pages) White Electronic Designs Corporation – 32Mx72 DDR SDRAM

White Electronic Designs
W3E32M72S-XBX
A simple algorithm for meeting both refresh and DLL
requirements is to apply NOPs for tXSNR time, then a DLL
Reset and NOPs for 200 additional clock cycles before
applying any other command.
* Self refresh available in commercial and industrial temperatures only.
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on VCC, VCCQ Supply relative to Vss
Voltage on I/O pins relative to Vss
Operating Temperature TA (Mil)
Operating Temperature TA (Ind)
Storage Temperature, Plastic
Unit
-1 to 3.6
V
-0.5V to VCCQ +0.5V
V
-55 to +125
°C
-40 to +85
°C
-55 to +125
°C
NOTE:Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
CAPACITANCE (NOTE 13)
Parameter
Input Capacitance: CK/CK#
Addresses, BA0-1 Input Capacitance
Input Capacitance: All other input-only pins
Input/Output Capacitance: I/Os
Symbol
Max
Unit
CI1
8
pF
CA
32
pF
CI2
10
pF
CIO
12
pF
BGA THERMAL RESISTANCE
Description
Junction to Ambient (No Airflow)
Junction to Ball
Junction to Case (Top)
Symbol
Max
Theta JA
13.7
Theta JB
10.3
Theta JC
4.6
Refer to "PBGA Thermal Resistance Correlation" Application Note at www.whiteedc.com in the application notes section for modeling conditions.
Units
°C/W
°C/W
°C/W
Notes
1
1
1
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2006
Rev. 2
10
White Electronic Designs Corporation • [phone] • www.wedc.com