W72M64VK-XBX Datasheet, PDF (1/16 Pages) White Electronic Designs Corporation – 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package

White Electronic Designs
W72M64VK-XBX
2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
FEATURES
Access Times of 90, 100, 120ns
Packaging
• 159 PBGA, 13x22mm - 1.27mm pitch
1,000,000 Erase/Program Cycles
Sector Architecture
• Bank 1 (4Mb): eight 4K word, eight 32K word
• Bank 2 (12Mb): twenty-four 32K word
• Bank 3 (12Mb): twenty-four 32K word
• Bank 4 (4Mb): eight 32K word
Bottom boot block
Zero Power Operation
Organized as 2Mx64 or 2x2Mx32
Commercial, Industrial and Military Temperature
Ranges
3.3 Volt for Read and Write Operations
Simultaneous Read/Write Operation:
• Data can be continuously read from one bank
while executing erase/program functions in
another bank
• Zero latency between read and write operations
Erase Suspend/Resume
• Suspends erase operations to allow programming
in same bank
Data# Polling and Toggle Bits
• Provides a software method of detecting the
status of program or erase cycles
Unlock Bypass Program command
• Reduces overall programming time when issuing
multiple program command sequences
Ready/Busy# output (RY/BY#)
• Hardware method for detecting program or erase
cycle completion
Hardware reset pin (RESET#)
• Hardware method of resetting the internal state
machine to the read mode
WP#/ACC input pin
• Write protect (WP#) function allows protection
two outermost boot sectors, regardless of sector
protect status
• Acceleration (ACC) function accelerates program
timing
Sector Protection
• Hardware method of locking a sector, either
in-system or using programming equipment, to
prevent any program or erase operation within
that sector
• Temporary Sector Unprotect allows changing
data in protected sectors in-system
Note: For programming information refer to Flash Programming
W72M64V-XBX Application Note.
This product is subject to change without notice.
April 2005
Rev. 0
1
White Electronic Designs Corporation • [phone] • www.wedc.com