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PACKAGIN Datasheet, PDF (9/9 Pages) Vishay Siliconix – Packaging Information
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Packaging Information
Vishay General Semiconductor
SURFACE MOUNT TAPE AND REEL PACKAGING
De-Reeling Direction
T2
T
Top
Cover
Tape
B1 (1)
K0
B0
P0
P2
10 P0itches Cumulative Tolerance on Tape ± 0.2
D0
E
A0 (2)
F
W
E2
TVS Polarization
GL41, SMA, SMB, SMC,
SMP, MicroSMP, SMPC,
SlimSMA, DO-218AB/2E
S1
T1
Notes
P1
(1) For machine reference only, including draft and
radii concentric around B0
(2) See note 1 and table
D1 for components
2.0 mm x 1.2 mm and larger
Fig. 13
Rectifiers
Polarization
DO-218AB/2D
DFS and MBS
Polarization
8 mm, 12 mm, 16 mm, AND 24 mm EMBOSSED TAPE in millimeters (inches)
TAPE SIZE
8 mm, 12 mm
16 mm, 24 mm
D0
1.5 ± 0.1
(0.059 ± 0.004)
E1
P0
1.75 ± 0.1
4.0 ± 0.1
(0.069 ± 0.004) (0.157 ± 0.004)
P2
2.0 ± 0.05
(0.79 ± 0.002)
2.0 ± 0.1
(0.79 ± 0.004)
A0, B0, K0
(1)
S1 MIN.
0.6
(0.024)
T MAX.
0.600
(0.024)
T1 MAX.
0.1
(0.004)
DIMENSIONS in millimeters (inches)
CASE TYPE
TAPE
SIZE
B1 MAX.
D1 MIN.
E2 MAX.
F
P1
R REF.
DO-213AA (GL34)
MicroSMP
8
(0.315)
4.2
(0.165)
3.28
(0.129)
1.0
(0.39)
6.25
(0.246)
6.05
(0.238)
3.5 ± 0.05
(0.138 ± 0.002)
25
(0.984)
DO-213AB (GL41)
DO-214BA (GF1)
DO-214AC(SMA)
DO-220AA (SMP)
12
(0.472)
8.2
(0.323)
4.0 ± 0.10
(0.57 ± 0.004)
10.25
5.5 ± 0.05
(0.404) (0.217 ± 0.002)
TO-277A (SMPC)
DO-214AA (SMB)/
DO-215AA (SMBG)
DO-214AB (SMC)/
DO-215AB (SMCG)
DFS
TO-263AB
DO-218AB
SMPD
DO-221AC
(SlimSMA)
7.0
(2.76)
8.2
(0.323)
16
12.1
(0.630) (0.476)
24
20.1
(0.945) (0.791)
12
6.2
(0.472) (0.244)
1.5
(0.059)
1.5
(0.059)
8.0 ± 0.10
30
(0.315 ± 0.004) (1.181)
14.25
(0.561)
22.25
(0.876)
10.25
(0.404)
7.5 ± 0.05
(0.295 ± 0.002)
11.5 ± 0.1
(0.453 ± 0.004)
5.5 ± 0.05
(0.217 ± 0.002)
12.0 ± 0.10
(0.472 ± 0.004)
16.0 ± 0.10
(0.630 ± 0.004)
12.0 ± 0.10
(0.472 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.001)
T2 MAX.
2.4
(0.094)
1.919
(0.076)
4.5
(0.177)
3.25
(0.128)
2.64
(0.104)
1.84
(0.072)
1.43
(0.056)
2.77
(0.109)
2.64
(0.104)
3.91
(0.154)
5.31
(0.209)
2.35
(0.093)
1.53
(0.060)
W
8.0 ± 0.30
(0.315 ± 0.012)
12.0 ± 0.30
(0.472 ± 0.012)
16.0 ± 0.2
(0.630 ± 0.008)
24.0 ± 0.3
(0.945 ± 0.008)
12.0 ± 0.3
(0.472 ± 0.012)
Notes
(1) A0, B0, and K0 are determined by the maximum dimensions of the component size. The clearance between the component and the cavity
must be within 0.05 mm (0.002") min. to 0.5 mm (0.02") max. for 8 mm tape and 12 mm tape, 0.15 mm (0.066") min. to 0.90 mm (0.035")
max. for 16 mm tape and 0.15 mm (0.006") min. to 1.0 mm (0.59") max. for 24 mm tape.
(2) All surface mount components are packed in accordance with EIA standard 481-C
Revision: 01-Feb-13
9
Document Number: 88869
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