DG3516_11 Datasheet, PDF (9/10 Pages) Vishay Siliconix – 300 MHz, 2.5ohm, Dual SPDT Analog Switches

DG3516, DG3517
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 10 BUMP (4 mm x 3 mm, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)
10 X Ø 0.150  0.229
Note b
Solder Mask Ø  Pad Diameter + 0.1
0.5
0.5
Recommended Land Pattern
A
A₂
A₁
b Diameter
4
3
2
1
Index-Bump A1
e
Note c
XXX
3516
Top Side (Die Back)
e
S
S
e
e
e
D
Notes (Unless Otherwise Specified):
a. Bump is Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.
Silicon
Bump
Note a
A
B
E
C
Dim.
A
A₁
A₂
b
D
E
e
S
Min.
0.688
0.218
0.470
0.306
1.980
1.480
0.230
Notes:
a. Use millimeters as the primary measurement.
Millimeters^a
0.5 BASIC
Max.
0.753
0.258
0.495
0.346
2.020
1.520
0.270
Min.
0.0271
0.0086
0.0185
0.0120
0.0780
0.0583
0.0091
Inches
0.0197 BASIC
Max.
0.0296
0.0102
0.0195
0.0136
0.0795
0.0598
0.0106
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?73404.
Document Number: 73404
www.vishay.com
S11-1185-Rev. D, 13-Jun-11
9
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000