DG3516 Datasheet, PDF (9/10 Pages) Vishay Siliconix – 300-MHz, 2.5-Ω, Dual SPDT Analog Switches

DG3516/DG3517
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 10 BUMP (4 x 3, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)
10 X Ø 0.150 ∼ 0.229
Note b
Solder Mask Ø ∼ Pad Diameter + 0.1
0.5
0.5
Recommended Land Pattern
A
A₂
A₁
b Diameter
4
3
2
1
Index-Bump A1
e
Note c
XXX
3516
Top Side (Die Back)
e
S
S
e
e
e
D
Notes (Unless Otherwise Specified):
a. Bump is Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.
Silicon
Bump
Note a
A
B
E
C
Millimeters^a
Dim
Min
Max
Inches
Min
Max
A
0.688
0.753
0.0271
0.0296
A₁
0.218
0.258
0.0086
0.0102
A₂
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.980
2.020
0.0780
0.0795
E
1.480
1.520
0.0583
0.0598
e
0.5 BASIC
0.0197 BASIC
S
0.230
0.270
0.0091
0.0106
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Tech-
nology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?73404.
Document Number: 73404
S-70853-Rev. C, 30-Apr-07
www.vishay.com
9