VBUS05A1-SD0 Datasheet, PDF (8/10 Pages) Vishay Siliconix – Low Capacitance Bidirectional Symmetrical (BiSy) Single Line ESD-Protection Diode in Silicon Package

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VBUS05A1-SD0
Vishay Semiconductors
TABLE 2 - SnPb EUTECTIC PROCESS - CLASSIFICATION TEMPERATURES (T_C)
PACKAGE THICKNESS
VOLUME mm³
< 350
VOLUME mm³
 350
< 2.5 mm
235 °C
220 °C
 2.5 mm
220 °C
220 °C
TABLE 3 - LEAD (Pb)-FREE PROCESS - CLASSIFICATION TEMPERATURES (T_C)
PACKAGE THICKNESS
VOLUME mm³
< 350
VOLUME mm³
350 to 2000
< 1.6 mm
260 °C
260 °C
1.6 mm to 2.5 mm
260 °C
250 °C
> 2.5 mm
250 °C
245 °C
VOLUME mm³
> 2000
260 °C
245 °C
245 °C
Notes
5. At the direction of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (T_p) can
exceed the values specified in tables 2 and 3. The use of a higher T_p does not change the classification temperature (T_C).
6. Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.
7. The maximum component temperature reached during reflow depends on package thickness and volume. The use on convection reflow
processes reduces the thermal gradients between packages. However thermal gradients due to differences in thermal mass of SMD
packages may still exist.
8. Moisture sensitivity levels of components intended for use in a lead (Pb)-free assembly process shall be evaluated using the lead (Pb)-free
classification temperatures and profiles defined in table 1 and 3, whether or not lead (Pb)-free.
9. SMD packages classified to a given moisture sensitivity level by using procedures or criteria defined within any previous version of
J-STD-020, JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in
classification level or a higher peak classification temperature is desired.
6. SOLDERING QUALITY INISPECTION
An X-ray inspection system is required to find defects such
as shorts between pads, open contacts, and voids within
the solder. In addition, a visual inspection by microscope or
camera (of appropriate magnification) can be used to
inspect the sides of the solder joints for acceptable shape
and molten solder.
7. SHEAR TEST COMPARISON
The data below shows a comparison of shear strength after
a reflow soldering process.
Typical shear strength
VISHAY
500 g
COMPETITOR 1
350 g
COMPETITOR 2
600 g
COMPETITOR 3
440 g
8. REWORK PROCEDURE
For rework, the CLP0603 package must be removed from
the PCB if there is any issue with the solder joints. Standard
SMT rework systems are recommended for this. Due to the
small size of the package, the rework system should be
equipped with a proper magnification aid.
9. INTERCHANGEABILITY OF THE CLP WITH A
PLASTIC PACKAGE OF THE SAME SIZE
Based on our studies, the CLP is 100 % compatible with
plastic packages of the same size.
Rev. 1.0, 09-Jul-13
8
Document Number: 85245
For technical questions, contact: [e-mail]
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