VBUS05A1-SD0 Datasheet, PDF (7/10 Pages) Vishay Siliconix – Low Capacitance Bidirectional Symmetrical (BiSy) Single Line ESD-Protection Diode in Silicon Package

www.vishay.com
VBUS05A1-SD0
Vishay Semiconductors
Supplier T_P ≥ T_C
Supplier t_P
T_C
T_C
- 5 °C
User T_P ≤ T_C
User t_P
T_P
Max. Ramp Up Rate = 3 °C/s
t_p
Max. Ramp Down Rate = 6 °C/s
T_L
T_Smax.
Preheat Area
t_L
T_Smin.
t_S
25
Time 25 °C to Peak
Time
T_C - 5 °C
TABLE 1 - CLASSIFICATION REFLOW PROFILES
PROFILE FEATURE
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
PREHEAT AND SOAK
Temperature min. (T_Smin.)
Temperature max. (T_Smax.)
Time (T_Smin. to T_Smax.) (t_S)
Average ramp-up rate (T_Smax. to T_p)
Liquidous temperature (T_L)
Time to liquidous (t_L)
Peak package temperature (T_p) ⁽¹⁾
Time (t_p) ⁽²⁾ with 5 °C of the specified
classification temperature (T_C)
Average ramp-down rate (T_p to T_Smax.)
Time 25 °C to peak temperature
100 °C
150 °C
150 °C
200 °C
60 s to 120 s
60 s to 120 s
3 °C/s maximum
183 °C
217 °C
60 s to 150 s
60 s to 150 s
See classification temperature in table 3
See classification temperature in table 4
20 s ⁽²⁾
30 s ⁽²⁾
6 min maximum
6 °C/s maximum
8 min maximum
Notes
(1) _{Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and user maximum}
(2) _{Tolerance for time at peak profile temperature (Tp) is defined as a supplier minimum and user maximumï€} 
Notes
1. All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow
(e.g. live-bug). If parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e. dead-bug). T_p shall be within ± 2 °C
of the live-bug T_p and still meet the T_C requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure
actual peak package body temperatures refer to JEP140 for the recommended thermocouple use.
2. Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board
assembly profiles should be developed based on specific process needs and board designs and should not exceed the parameters in
table 1. For example, if T_C is 260 °C and time t_p is 30 s, this means the following for the supplier and the user:
- For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 s.
- For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 s.
3. All components in the test load shall meet the classification profile requirements.
4. SMD packages classified to a given moisture sensitivity level by using procedures or criteria defined within any previous version of
J-STD-020, JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in
classification level or a higher peak classification temperature is desired.
Rev. 1.0, 09-Jul-13
7
Document Number: 85245
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000