MMU0102HF Datasheet, PDF (8/11 Pages) Vishay Siliconix – High Frequency Thin Film MELF Resistors

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MMU 0102 HF, MMA 0204 HF, MMB 0207 HF
Vishay Beyschlag
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2 ⁽¹⁾
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
MMU 0102 HF
6.8  to 470 
MMA 0204 HF
1.5  to 475 
MMB 0207 HF
6.8  to 470 
Short time overload;
standard operation mode
4.13
-
Short time overload;
power operation mode
U = 2.5 x P₇₀ x R ;
5s
U = 2.5 x P₇₀ x R ;
5s
IEC 61340-3-1 ⁽¹⁾;
4.40
-
Electrostatic discharge
(human body model)
3 pos. + 3 neg. discharges
MMU 0102 HF: 800 V
MMA 0204 HF: 1000 V
MMB 0207 HF: 2000 V
± (0.1 % R + 0.01 )
± (0.1 % R + 0.01 )
± (0.5 % R + 50 m)
4.29
45 (XA) Component solvent resistance
Isopropyl alcohol;
50 °C; method 2
No visible damage
4.30
45 (XA) Solvent resistance of marking
Isopropyl alcohol; 50 °C;
method 1, toothbrush
Marking legible; no visible damage
4.17
58 (Td)
Solderability
Solder bath method; SnPb40;
non-activated flux;
(215 ± 3) °C; (3 ± 0.3) s
Solder bath method; SnAg3Cu0.5 or
SnAg3.5; non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning ( 95 % covered);
no visible damage
Good tinning ( 95 % covered);
no visible damage
4.18
58 (Td) Resistance to soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.5 % R + 0.05 )
4.32
4.35
21 (Ue₃)
-
Shear (adhesion)
Flammability
45 N
IEC 60 695-11-5 ⁽¹⁾,
needle flame test; 10 s
No visible damage
No burning after 30 s
Note
(1) _{The quoted IEC standards are also released as EN standards with the same number and identical contents.}
Revision: 26-Oct-15
8
Document Number: 28718
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