DG3001 Datasheet, PDF (8/9 Pages) Vishay Siliconix – Low-Voltage Sub-Ohm SPST/SPDT MICRO FOOT® Analog Switch

DG3001/3002/3003
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (3 x 2, 0.5 mm PITCH, 165 µm BUMP HEIGHT)
6 x Ø 0.150 ∼ 0.229
Note b
Solder Mask Ø ∼ Pad Dia. + 0.1
0.5
0.5
Recommended Land Pattern
A
A₂
A₁
Index-Bump A1
Note c
b Diameter
3
2
1
XXX
3003
Top Side (Die Back)
e
S
S
Notes (Unless Otherwise Specified):
a. Bump is Eutectic 63/57 Sn/Pb or Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
e
D
Silicon
Bump
Note a
A
E
B
EUTECTIC (Sn/Pb)
Millimeters^a
Inches
Dim
Min
Max
Min
Max
A
0.610
0.685
0.0240
0.0270
A₁
0.140
0.190
0.0055
0.0075
A₂
0.470
0.495
0.0185
0.0195
b
0.180
0.250
0.0071
0.0098
D
1.490
1.515
0.0587
0.0596
E
0.990
1.015
0.0390
0.0400
e
0.5 BASIC
0.0197 BASIC
S
0.245
0.258
0.0096
0.0101
Notes:
a. Use millimeters as the primary measurement.
LEAD (Pb)-FREE (Sn/Ag/Cu)
Millimeters^a
Inches
Dim
Min
Max
Min
Max
A
0.688
0.753
0.0271
0.0296
A₁
0.218
0.258
0.0086
0.0102
A₂
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.490
1.515
0.0587
0.0596
E
0.990
1.015
0.0390
0.0400
e
0.5 BASIC
0.0197 BASIC
S
0.245
0.258
0.0096
0.0102
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Tech-
nology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?72505.
www.vishay.com
8
Document Number: 72505
S-70853–Rev. C, 30-Apr-07