591D Datasheet, PDF (8/10 Pages) Vishay Siliconix – Solid Tantalum Chip Capacitors TANTAMOUNT, Low Profile, Low ESR, Conformal Coated, Maximum CV

591D
Vishay Sprague
GUIDE TO APPLICATION
4.0 Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10% of the DC rating or 1 volt maximum at
+ 25°C and 5% of the DC voltage rating or 0.5 volt
maximum at + 85°C.
5.0 Temperature Derating: If these capacitors are to be
operated at temperatures above + 25°C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
Temperature
+ 25°C
+ 85°C
+ 125°C
Derating Factor
1.0
0.9
0.4
5. Power Dissipation: Power dissipation will be affected
by the heat sinking capability of the mounting surface.
Non-sinusoidal ripple current may produce heating
effects which differ from those shown. It is important
that the equivalent Irms value be established when
calculating permissible operating levels. (Power
dissipation calculated using + 25°C temperature rise.)
Case Code
A
B
C
D
R
U
V
W
Maximum Permissible
Power Dissipation
@ + 25°C (Watts) in free air
0.075
0.085
0.110
0.150
0.165
0.110
0.140
0.175
6. Printed Circuit Board Materials: The capacitors are
compatible with most commonly used printed circuit
board materials (alumina substrates, FR4, FR5,
G10, PTFE-fluorocarbon and porcelanized steel). If
your desired board material is not shown there please
contact the Tantalum Marketing Department for
assistance in determining compatibility.
7. Attachment:
7.1 Solder Paste: The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178mm ± 0.025mm]. Care should be exercised in
selecting the solder paste. The metal purity should
be as high as practical. The flux (in the paste) must
be active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
7.2 Soldering: Capacitors can be attached by
conventional soldering techniques - convection,
infrared reflow, wave soldering and hot plate methods.
The Soldering Profile chart shows typical recomended
time/temperature conditions for soldering. Attachment
with a soldering iron is not recommended due to the
difficulty of controlling temperature and time at
temperature. The soldering iron must never come in
contact with the capacitor.
RECOMMENDED REFLOW SOLDERING PROFILE
250
200
150
100
50
0
50
100
150
200
250
TIME (SECONDS)
300 350
7.1 Recommended Mounting Pad Geometries: The
nib must have sufficient clearance to avoid electrical
contact with other components. The width dimension
indicated is the same as the maximum width of the
capacitor. This is to minimize lateral movement.
REFLOW SOLDER PADS* in inches [millimeters]
B
C
B
A
CASE
CODE
A
B
C
D
R
U
V
W
WIDTH
(A)
0.083
[2.1]
0.138
[3.5]
0.138
[3.5]
0.180
[4.6]
0.322
[8.1]
0.138
[3.5]
0.180
[4.6]
0.327
[8.3]
PAD
METALIZATION
0.067
[1.7]
0.067
[1.7]
0.090
[2.3]
0.090
[2.3]
0.090
[2.3]
0.090
[2.3]
0.090
[2.3]
0.090
[2.3]
SEPARATION
(C)
0.050
[1.3]
0 .067
[1.7]
0.127
[3.1]
0.145
[3.7]
0.145
[3.7]
0.122
[3.1]
0.145
[3.7]
0.145
[3.7]
* Pads for B, C and D case codes are otherwise pad compatible with
* Type 293D, B, C and D case codes respectively.
8. Cleaning (Flux Removal) After Soldering: The
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. Solvents
containing methylene chloride or other epoxy solvents
should be avoided since these will attack the epoxy
encapsulation material.
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Document Number 40012
Revision 22-Nov-04