VBPW34S_11 Datasheet, PDF (7/8 Pages) Vishay Siliconix – Silicon PIN Photodiode

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VBPW34S, VBPW34SR
Vishay Semiconductors
REEL DIMENSIONS FOR VBPW34S AND VBPW34SR in millimeters
21732
SOLDER PROFILE
300
250
255 °C
240 °C
217 °C
200
150
max. 120 s
100
max. 260 °C
245 °C
max. 30 s
max. 100 s
50 max. ramp up 3 °C/s max. ramp down 6 °C/s
0
0
50 100 150 200 250 300
19841
Time (s)
Fig. 8 - Lead (Pb)-free Reflow Solder Profile
acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 3
Floor life: 168 h
Conditions: T_amb < 30 °C, RH < 60 %
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or
recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %.
Rev. 1.2, 24-Aug-11
7
Document Number: 81128
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000