TNPW Datasheet, PDF (6/8 Pages) Vishay Siliconix – Thin Film, Rectangular, Resistor Chips

www.vishay.com
TNPW
Vishay
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
IEC 60115-1, generic specification (includes tests)
EN 140400, sectional specification (includes schedule for
qualification approval)
EN 140401-801, detail specification (includes schedule for
conformance inspection)
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1. The tests are carried out
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. A climate category is applied, defined by
the lower category temperature (LCT), the upper category
temperature (UCT), and the number of days of the damp
heat, steady-state test (56).
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN60115-1, 4.31 unless otherwise
specified. The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN140401-801.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1 
CLAUSE
IEC 60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS PERMISSIBLE CHANGE (R)
Stability for
product type:
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
10  to < 100 
100  to 3.01 M 10  to 3.01 M
4.5
-
Resistance
-
± 0.1 %
± 1 %; ± 0.5 %
4.8.4.2
-
Temperature At (20/- 55/20) °C
coefficient and (20/125/20) °C
± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
± 50 ppm/K;
± 25 ppm/K
4.25.1
Endurance
U = P₇₀ x R
or  U_max.;
-
1.5 h on; 0.5 h off;
at 70 °C
70 °C; 1000 h ± (0.1 % R + 0.02 ) ± (0.05 % R + 0.01 ) ± (0.25 % R + 0.05 )
4.25.3
Endurance
-
at upper
category
125 °C; 1000 h ± (0.1 % R + 0.02 ) ± (0.05 % R + 0.01 ) ± (0.5 % R + 0.05 )
temperature
4.13
4.24
-
78 (Cab)
Short time
overload
U = 2.5 x P₇₀ x R
2 x U_max.; 2 s
± (0.05 % R + 0.01 ) ± (0.02 % R + 0.01 ) ± (0.1 % R + 0.02 )
Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
± (0.1 % R + 0.02 ) ± (0.05 % R + 0.01 ) ± (0.5 % R + 0.05 )
4.19
14 (Na)
Rapid change
of temperature
30 min at - 55 °C:
30 min at 125 °C;
5 cycles
± (0.05 % R + 0.01 ) ± (0.02 % R + 0.01 ) ± (0.1 % R + 0.02 )
4.18.2
58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C;
(10 ± 1) s
± (0.05 % R + 0.01 ) ± (0.02 % R + 0.01 )
± (0.1 % R + 0.02 )
4.35
-
Flammability,
needle flame
test
IEC 60695-11-5;
10 s
No burning after 30 s
Revision: 24-Jan-14
6
Document Number: 31006
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000