ACAS0606 Datasheet, PDF (5/8 Pages) Vishay Siliconix – Precision Thin Film Chip Resistor Array Superior Moisture Resistivity

ACAS 0606 AT, ACAS 0612 AT - Precision
Vishay Beyschlag
Precision Thin Film Chip Resistor Array
Superior Moisture Resistivity
DESCRIPTION
The production of the components is strictly controlled and
follows an extensive set of instructions established for
reproducibility. A homogeneous film of metal alloy is
deposited on a high grade (96 % Al₂O₃) ceramic substrate
using a mask to separate the adjacent resistors and
conditioned to achieve the desired temperature coefficient.
Specially designed inner contacts are realized on both sides.
A special laser is used to achieve the target value by
smoothly cutting a meander groove in the resistive layer
without damaging the ceramics.
The resistor elements are covered by a protective coating
designed for electrical, mechanical and climatic protection.
The terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with IEC 60286-3 ⁽³⁾.
ASSEMBLY
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using reflow or vapour phase as shown in
IEC 61760-1 ⁽³⁾. The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions.
All products comply with the GADSL ⁽¹⁾ and the
CEFIC-EECA-EICTA ⁽²⁾ list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
The suitability of conformal coatings, if applied, shall be
qualified by appropriate means to ensure the long-term
stability of the whole system. The resistors are RoHS
compliant; the pure tin plating provides compatibility with
lead (Pb)-free and lead-containing soldering processes. The
permitted storage time is 20 years, whereas the solderability
is specified for 2 years after production or requalification. The
immunity of the plating against tin whisker growth has been
proven under extensive testing.
• 2002/95/EC Restriction of the use of Hazardous
Substances directive (RoHS)
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
APPROVALS
The chip resistor array is AEC-Q200 qualified.
Where applicable, the resistors are tested in accordance with
EN 140401-801 which refers to EN 60115-1 and EN 140400.
Notes
(1) _{Global Automotive Declarable Substance List, see www.gadsl.org}
(2) _{CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade}
organisation representing the information and communications technology and consumer electronics), see www.eicta.org → policy →
environmental policy group → chemicals → jig → Joint Industry Guide (JIG-101 Ed 2.0)
(3) _{The quoted IEC standards are also released as EN standards with the same number and identical contents}
FUNCTIONAL PERFORMANCE
Power Mode
Standard Mode
100
80
60
40
20
0
- 55
0
50 ₇₀
100 125
155 180
Ambient Temperature in °C
For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED POWER, above
Derating
www.vishay.com
280
For technical questions, contact: [e-mail]
Document Number: 28770
Revision: 06-Nov-09