84063 Datasheet, PDF (5/5 Pages) Vishay Siliconix – The Constituents of Semiconductor Components

VISHAY
Vishay Semiconductors
Contents of a Diode in Sintered Glass Package G4
Total weight 1040 mg
Leads, tinned
Copper
Cu
Molybdenum
Mo
Tin
Sn
Lead
Pb
Silver
Ag
Phosphorus
P
Traces of S. O₂, C
Package, glass:
Zinc Oxide
ZnO
B₂O₃
SiO₂
PbO
Sb₂O₃
Traces of P, Pt
Silicon chip:
Silicon
Si
Aluminum
Al
62,19 %
69,09 %
29,63 %
0,95 %
0,17 %
0,10 %
0,06 %
37,58 %
62,70 %
24,00 %
10,00 %
2,80 %
0,50 %
0,23 %
93,12 %
6,88 %
mg
446,86
191,64
6,14
1,10
0,65
0,39
245,05
93,80
39,08
10,94
1,95
2,23
0,16
ppm
429,671
184,269
5,908
1,057
0,622
0,373
235,627
90,192
37,580
10,522
1,879
2,142
0,158
Significant Materials for Disposal
No.
Material and/or Group ¹⁾
1
Lead and compounds
2
Molybdenum and compounds
Note: *), **), ***), ¹⁾, ²⁾, CMT, T
C T S HW
M
AL G
T
K
Available
in the Compound
Used for
²
² Package glass, lead
²
Lead
Part in ²⁾
Weight
Percent
6.0
15.9
L DMN T H
²²²
²
Document Number 84063
Rev. 7, 07-Jan-03
www.vishay.com
5