84063 Datasheet, PDF (4/5 Pages) Vishay Siliconix – The Constituents of Semiconductor Components

Vishay Semiconductors
Contents of a Diode in Sintered Glass Package G1
Total weight 560 mg
Leads, tinned
Copper
Cu
Molybdenum
Mo
Tin
Sn
Lead
Pb
Silver
Ag
Phosphorus
P
Traces of S, O₂, C
Package, glass:
ZnO
B₂O₃
SiO₂
PbO
Sb₂O₃
Traces of P, Pt
Silicon chip:
Silicon
Si
Aluminum
Al
62,19 %
77,68 %
20,64 %
1,31 %
0,23 %
0,08 %
0,06 %
37,58 %
62,70 %
24,00 %
10,00 %
2,80 %
0,50 %
0,23 %
93,55 %
6,45 %
Contents of a Diode in Sintered Glass Package G3
Total weight 1100 mg
Leads, tinned
Copper
Cu
Molybdenum
Mo
Tin
Sn
Lead
Pb
Silver
Ag
Phosphorus
P
Traces of S, O₂, C
Package, glass:
Zinc Oxide
ZnO
B₂O₃
SiO₂
PbO
Sb₂O₃
Traces of P, Pt
Silicon chip:
Silicon
Si
Aluminum
Al
62,19 %
77,84 %
21,06 %
0,83 %
0,15 %
0,07 %
0,05 %
37,58 %
62,70 %
24,00 %
10,00 %
2,80 %
0,50 %
0,23 %
93,57 %
6,43 %
mg
270,53
71,88
4,56
0,80
0,28
0,21
131,95
50,51
21,04
5,89
1,05
1,20
0,08
mg
532,50
144,07
5,68
1,03
0,48
0,34
259,19
99,21
41,34
11,57
2,07
2,37
0,16
VISHAY
ppm
483,092
128,360
8,147
1,430
0,498
0,373
235,627
90,192
37,580
10,522
1,879
2,152
0,148
ppm
484,087
130,972
5,162
0,933
0,435
0,311
235,627
90,192
37,580
10,522
1,879
2,152
0,148
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4
Document Number 84063
Rev. 7, 07-Jan-03