140CRH_11 Datasheet, PDF (5/13 Pages) Vishay Siliconix – Aluminum Capacitors SMD (Chip), High Temperature

Aluminum Capacitors
SMD (Chip), High Temperature
140 CRH
Vishay BCcomponents
STANDARD SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS
T (°C)
T_Peak
230
217
t₄
200
t₃
150
t₁
t₂
time (s)
Fig. 4 - Maximum temperature load during reflow soldering
Table 4
REFLOW SOLDERING CONDITIONS for MAL214097xxxE3
PROFILE FEATURES
CASE CODE
0810 TO 1014
Max. time from 25 °C to T_Peak
Min. ramp-up rate to 150 °C
240 s
3 K/s
Max. time from 150 °C to 200 °C (t₁)
150 s
Ramp up rate from 200 °C to T_Peak
0.5 K/s to 3 K/s
Max. time from 200 °C to 217 °C (t₂)
60 s
Max. time above T_Liquidus (217 °C) (t₃)
90 s
Max. time above 230 °C (t₄)
40 s
Peak temperature T_Peak
250 °C
Max. time above T_Peak minus 5 °C
5s
Max. ramp-down rate from T_Liquidus
3 K/s to 6 K/s
Notes
• Temperature measuring point on top of the case and on terminals
• Max. 2 runs with pause of min. 30 min in between
CASE CODE
1213 TO 1216
200 s
3 K/s
120 s
0.5 K/s to 3 K/s
60 s
60 s
30 s
240 °C
10 s
3 K/s to 6 K/s
Document Number: 28396
Revision: 09-May-11
For technical questions, contact: [e-mail]
www.vishay.com
5
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000