CHPHT Datasheet, PDF (4/6 Pages) Vishay Siliconix – High Temperature (245 °C) Thick Film Chip Resistor

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PERFORMANCE
TESTS
Termination adhesion
Resistance to solder heat
Rapid temperature change
Climatic sequence
Humidity (steady state)
Moisture resistance
Short time overload
Load life
Shelf life
CONDITIONS
5N for 10 s
Immersion 10 s
in Sn/Pb 60/40
at +260 °C
5 cycles
-55 °C to +155 °C
Phase A dry heat
Phase B damp heat
Phase C cold -55 °C
Phase D damp heat 5 cycles
56 days
AEC-Q200
85 °C/85 % RH/Pn
1000 h
6.25 Pn
for 2 s
1000 h at rated power
at 230 °C
1000 h at 245 °C
REQUIREMENTS
± (0.25 % + 0.05 )
± (0.25 % + 0.05 )
± (0.25 % + 0.05 )
± (1 % + 0.05 )
± (1 % + 0.05 )
3 % + 0.05 
± (0.25 % + 0.05 )
-
-
CHPHT
Vishay Sfernice
TYPICAL VALUES
AND DRIFTS
< ± 0.1 %
< ± 0.1 %
< ± 0.1 %
< ± 0.2 %
< ± 0.2 %
Max. < 3 % + 0.05 
< ± 0.1 %
1 % max.
1 % max.
GLOBAL PART NUMBER INFORMATION
Global Part Numbering: CHPHT0805K1001FGT
C H P H T 0 8 0 5 K 10 0 1FGT
GLOBAL
MODEL
CHPHT
SIZE
0603
0805
1206
2010
TCR
VALUE
TOLERANCE
TERMINATION ⁽¹⁾
PACKAGING
OPTION
K = 100 ppm
L = 200 ppm
The first 3 digits
are significant
figures and the
last digit specifies
the number of
zeros to follow.
R designates
decimal point
F=±1%
G=±2%
J=±5%
N: SnAg over nickel barrier
G: Gold over nickel barrier
For more
information see
“Codification of
packaging”
table
Leave blank
if no option
10R0 = 10 
3901 = 3900 
1004 = 1 M
Note
(1) _{N terminations for temperature up to 200 °C ï€} 
G terminations for temperature up to 230 °C
Revision: 21-Jul-14
4
Document Number: 52032
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000