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NCSERIES_15 Datasheet, PDF (3/4 Pages) Vishay Siliconix – Thin Film Single Value Chip and Wire Capacitors
www.vishay.com
DIMENSIONS
0.5 pF to 1.3 pF
1.4 pF to 3.9 pF
NC Series
Vishay Electro-Films
4 pF to 9.1 pF
10 pF to 51 pF
33 pF to 100 pF
NCAA
0.020 ± 0.003 inches square
56 pF to 220 pF
150 pF to 510 pF
360 pF to 1000 pF
NCBB
0.030 ± 0.003 inches square
NCCC
0.040 ± 0.003 inches square
NCDD
0.055 ± 0.003 inches square
NCEE
0.060 ± 0.003 inches square
MECHANICAL SPECIFICATIONS
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Dielectric
Bond Pad
Backing
VALUE
Per diagrams
0.010" ± 0.002" (0.25 mm ± 0.05 mm)
Semiconductor silicon
Silicon dioxide/silicon nitride
0.005" x 0.005" min., 10 kÅ aluminum
3 kÅ min. gold
Options: Gold bond pads 15 kÅ. Lower profile version is available, consult applications engineer
GLOBAL PART NUMBER INFORMATION
SAP Part Number: NCAA4700CKMAHWS
SAP Description: NCAA 4.7 pF 10 % MOS Al H WS
N
C
A
A
4
7
0
NCEE10000KNGKWS
NCEE 1000 pF 10 % MNOS Au K WS
0
C
K
M
A
H
WS
MODEL
NCAA
NCBB
NCCC
NCDD
NCEE
CAPACITANCE
(pF)
First 4 digits
are significant
figures of
capacitance
CAPACITANCE
MULTIPLIER
CODE
D = 0.0001
C = 0.001
B = 0.01
A = 0.1
0=1
TOLERANCE
CODE
D = ± 0.5 pF
H = 2.5 %
J = 5.0 %
K = 10 %
M = 20 %
DIELECTRIC
M = MOS
N = MNOS
TERMINATION
G = Au
A = Al
VISUAL
CLASS
H = Class H
K = Class K
PACKAGING
CODE
WS =
Waffle pack
100 min.,
1 mult
Revision: 02-May-13
3
Document Number: 61033
For technical questions, contact: efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000