MSP_15 Datasheet, PDF (3/5 Pages) Vishay Siliconix – Precision Surface Mount Resistors Wirewound or Metal Film Technologies

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MSP
Vishay Sfernice
PERFORMANCE
TESTS
Short Time Overload
Load Life
Dielectric w/s Voltage
Rapid Change of
Temperature
Climatic Sequence
Humidity
(Steady State)
Substrate Bending Test
Shock
Vibration
Resistance to 
Soldering Heat
POWER RATING
125
CONDITIONS
Wirewound
Metal Film
IEC 60115-1
5 P_r or U = 2 U_max./5 s
IEC 60115-1
90’/30’ cycles
1000 h P_r + 25 °C
8000 h P_r
IEC 60115-1
U_RMS = 500 V/60 s
IEC 60115-1
IEC 60068-2-14 Test Na
5 cycles (30’ at LCT/30’ at UCT)
- 55 °C/+ 200 °C
- 55 °C/+ 125 °C
IEC 60115-1
- 55 °C/+ 200 °C
- 55 °C/+ 125 °C
IEC 60115-1
IEC 60068-2-3 Test Ca
95 % HR/40 °C
56 days
10 days
IEC 60115-1
IEC 60068-2-21 Test U_e3
2 mm/10 times
IEC 60115-1
IEC 60068-2-27 Test Ea
50 g’s/half sine/3 times by direction (i.e. 18 shocks)
IEC 60115-1
IEC 60068-2-6 Test Fc
10 Hz/2000 Hz
10 Hz/500 Hz
IEC 60115-1
IEC 60068-2-58 Solder bath
260 °C/10 s
REQUIREMENTS
Wirewound
CECC 40402-801
Metal Film
± (0.25 % + 0.05 )
± 0.25 %
± (0.5 % + 0.05 )
± (3 % + 0.05 )
±1%
-
No flashover or breakdown
Leakage current < 10 μA
± (0.25 % + 0.05 )
± 0.25 %
± (0.5 % + 0.05 )
± 0.5 %
± (0.5 % + 0.05 )
±1%
± (0.25 % + 0.05 )
± (0.25 % + 0.05 )
± (0.25 % + 0.05 )
± (0.5 % + 0.05 )
± 0.25 %
n/a
± 0.25 %
n/a
TEMPERATURE RISE
250
100
MSP B
75
50
MSP C
25
200
MSP ^{3 B}
150
MSP ^{2 B}
100
MSP ^{2 C}
50
0
- 100 _{- 55}
0 ₂₅ 50
100
155 ²⁰⁰
AMBIENT TEMPERATURE IN °C
250 ₂₇₅
SURFACE MOUNTING OF MSP B
Soldering cycle: 2 min at 215 °C or 10 s at 260 °C or with an
iron 40 W: 3 s at 350 °C.
Soldering is possible by wave, reflow and vapor phase.
0
0
0.5
1
1.5
2
2.5
3
RATED POWER IN W
NON INDUCTIVE WINDING FOR MSP B
Non-inductive (Ayrton Perry) winding available.
Please consult Vishay Sfernice.
Revision: 24-Feb-14
3
Document Number: 50003
For technical questions, contact: [e-mail]
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000