MSP_15 Datasheet, PDF (1/5 Pages) Vishay Siliconix – Precision Surface Mount Resistors Wirewound or Metal Film Technologies

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MSP
Vishay Sfernice
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
FEATURES
• According to CECC 40402-801 (wirewound)
• Wide range of ohmic values (0.04  to 1 M)
• Low temperature coefficient 
(± 25 ppm/°C available)
• Good electrical insulation
• All welded construction and molded encapsulant
• High power ratings (up to 2.5 W)
• Stability class 0.5
• Pure matte tin termination
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Specially designed for surface mounting, the MSP series uses either wirewound or metal film technology. The molded package
ensures mechanical and climatic protection as well as high dielectric insulation. The MSP design is compatible with surface
mounting equipment and can withstand wave and reflow soldering techniques.
DIMENSIONS in millimeters
E
A
Recommended Soldering Areas
C
Z
B
W
F
F
D
X
X
SERIES
MSP 1
MSP 2
MSP 3
A
B
C
D
E
F
W
X
Z
WEIGHT in g
6.9
3.8
3.8
2.5
6.5
1.4
2.7
2.9
6
0.2
11.4
5
7
5
11
2.4
5.2
4.1
9.4
0.8
14.8
6.6
7
5
14.4
2.4
5.2
4.1
12.7
1.5
Note
• General tolerance: ± 0.2 mm
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
RESISTANCE
RANGE

RATED POWER
P_{25 °C}
W
MSP 1 B
0.04 to 2.2K
1
MSP 2 B
0.04 to 4.7K
2
MSP 3 B
0.04 to 13K
2.5
MSP 1 C
10 to 332K
0.5
MSP 2 C
10 to 1M
1


LIMITING ELEMENT
VOLTAGE
V
50
120
200
300
350
TOLERANCE
±%
0.5, 1, 2, 5
0.5, 1, 2, 5
0.5, 1, 2, 5
0.5, 1
0.5, 1
TEMPERATURE
COEFFICIENT
± ppm/°C
25, 50, 100
25, 50, 100
25, 50, 100
25, 50
25, 50
Revision: 24-Feb-14
1
Document Number: 50003
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000