VS-HFA08PB60PBF Datasheet, PDF (2/7 Pages) Vishay Siliconix – Ultrafast and ultrasoft recovery

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VS-HFA08PB60PbF, VS-HFA08PB60-N3
Vishay Semiconductors
ELECTRICAL SPECIFICATIONS (T_J = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
Cathode to anode
breakdown voltage
V_BR
I_R = 100 μA
I_F = 8.0 A
Maximum forward voltage
V_FM
I_F = 16 A
See fig. 1
I_F = 8.0 A, T_J = 125 °C
Maximum reverse 
leakage current
V_R = V_R rated
I_RM
See fig. 2
T_J = 125 °C, V_R = 0.8 x V_R rated
Junction capacitance
C_T
V_R = 200 V
See fig. 3
Series inductance
L_S
Measured lead to lead 5 mm from package body
MIN.
600
-
-
-
-
-
-
-
TYP.
-
1.4
1.7
1.4
0.3
100
10
8.0
MAX.
-
1.7
2.1
1.7
5.0
500
25
-
UNITS
V
μA
pF
nH
DYNAMIC RECOVERY CHARACTERISTICS (T_J = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
Reverse recovery time
See fig. 5, 10
t_rr
I_F = 1.0 A, dI_F/dt = 200 A/μs, V_R = 30 V
t_rr1
T_J = 25 °C
t_rr2
T_J = 125 °C
-
18
-
37
-
55
Peak recovery current
See fig. 6
Reverse recovery charge
See fig. 7
Peak rate of fall of recovery
current during t_b
See fig. 8
I_RRM1
I_RRM2
Q_rr1
Q_rr2
dI_(rec)M/dt1
dI_(rec)M/dt2
T_J = 25 °C
T_J = 125 °C
T_J = 25 °C
T_J = 125 °C
T_J = 25 °C
T_J = 125 °C
I_F = 8.0 A
dI_F/dt = 200 A/μs
V_R = 200 V
-
3.5
-
4.5
-
65
-
124
-
240
-
210
MAX.
-
55
90
5.0
8.0
138
360
-
-
UNITS
ns
A
nC
A/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Thermal resistance, 
junction to case
Thermal resistance, 
junction to ambient
Thermal resistance, 
case to heatsink
T_lead
R_JC
R_JA
R_CS
0.063" from case (1.6 mm) for 10 s
Typical socket mount
Mounting surface, flat, smooth and greased
Weight
Mounting torque
Marking device
Case style TO-247AC modified (JEDEC)
MIN.
-
-
-
-
-
-
6.0
(5.0)
TYP.
-
-
MAX.
300
3.5
UNITS
°C
-
40
K/W
0.25
-
6.0
-
0.21
-
-
12
(10)
HFA08PB60
g
oz.
kgf · cm
(lbf · in)
Revision: 20-Apr-16
2
Document Number: 94041
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000