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VS-42CTQ030S-M3 Datasheet, PDF (2/8 Pages) Vishay Siliconix – Center tap configuration
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VS-42CTQ030S-M3, VS-42CTQ030-1-M3
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average 
forward current 
See fig. 5
per leg
per device
IF(AV)
Maximum peak one cycle non-repetitive 
surge current per leg

IFSM
See fig. 7
Non-repetitive avalanche energy per leg
EAS
Repetitive avalanche current per leg
IAR
TEST CONDITIONS
VALUES
20
50 % duty cycle at TC = 121 °C, rectangular waveform
40
5 μs sine or 3 μs rect. pulse
10 ms sine or 6 ms rect. pulse
Following any rated load
condition and with rated
VRRM applied
TJ = 25 °C, IAS = 3 A, L = 2.90 mH
Current decaying linearly to zero in 1 μs
Frequency limited by TJ maximum VA = 1.5 x VR typical
1100
360
13
3
UNITS
A
mJ
A
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop per leg
See fig. 1
VFM (1)
Maximum reverse leakage current per leg
See fig. 2
Threshold Voltage
Forward slope resistance
Maximum junction capacitance per leg
Typical series inductance per leg
Maximum voltage rate of change
Note
(1) Pulse width < 300 μs, duty cycle < 2 %
IRM (1)
VF(TO)
rt
CT
LS
dV/dt
20 A
40 A
20 A
40 A
TJ = 25 °C
TJ = 125 °C
TEST CONDITIONS
TJ = 25 °C
TJ = 125 °C
VR = Rated VR
TJ =TJ maximum
VR = 5 VDC (test signal range 100 kHz to 1 MHz), 25 °C
Measured lead to lead 5 mm from package body
Rated VR
VALUES
0.48
0.57
0.38
0.51
3
183
0.22
6.76
2840
8.0
10 000
UNITS
V
mA
V
m
pF
nH
V/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum junction and storage
temperature range
Maximum thermal resistance,
junction to case per leg
Maximum thermal resistance,
junction to case per package
Typical thermal resistance, 
case to heatsink
TJ, TStg
RthJC
DC operation
RthCS
Mounting surface, smooth and greased
Approximate weight
Mounting torque
Marking device
minimum
maximum
Case style D2PAK
Case style TO-262
VALUES UNITS
-55 to 150 °C
2.0
1.0
°C/W
0.50
2
g
0.07
oz.
6 (5)
12 (10)
kgf cm
(lbf in)
42CTQ030S
42CTQ030-1
Revision: 21-Oct-14
2
Document Number: 94940
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