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SUD50P04-13L_08 Datasheet, PDF (2/6 Pages) Vishay Siliconix – P-Channel 40-V (D-S) 175 °C MOSFET
SUD50P04-13L
Vishay Siliconix
New Product
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
Gate-Source Threshold Voltage
V(BR)DSS
VGS(th)
VGS = 0 V, ID = - 250 µA
VDS = VGS, ID = - 250 µA
- 40
- 1.0
V
- 3.0
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
nA
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
ID(on)
VDS = - 40 V, VGS = 0 V
VDS = - 40 V, VGS = 0 V, TJ = 125 °C
VDS = - 5 V, VGS = - 10 V
- 50
-1
µA
- 50
A
VGS = - 10 V, ID = - 30 A
0.0105 0.013
Drain-Source On-State Resistancea
rDS(on)
VGS = - 10 V, ID = - 30 A, TJ = 125 °C
0.020
Ω
Forward Transconductancea
VGS = - 4.5 V, ID = - 20 A
0.017 0.022
gfs
VDS = - 15 V, ID = - 30 A
15
S
Dynamicb
Input Capacitance
Ciss
3120
Output Capacitance
Coss
VDS = - 25 V, VGS = 0 V, f = 1 MHz
440
pF
Reverse Transfer Capacitance
Crss
320
Gate Resistance
Rg
f = 1 MHz
4.3
Ω
Total Gate Chargec
Qg
63
95
Gate-Source Chargec
Qgs
VDS = - 20 V, VGS = - 10 V, ID = - 50 A
13
nC
Gate-Drain Chargec
Turn-On Delay Timec
Qgd
td(on)
16
15
25
Rise Timec
Turn-Off Delay Timec
tr
td(off)
VDD = - 20 V, RL = 0.4 Ω
ID ≅ - 50 A, VGEN = - 10 V, Rg = 2.5 Ω
18
30
ns
60
90
Fall Timec
tf
47
70
Drain-Source Body Diode Characteristics
Pulse Current
Forward Voltagea
ISM
VSD
IF = - 50 A, VGS = 0 V
- 100
- 1.0
- 1.5
V
Source-Drain Reverse Recovery Time
trr
IF = - 50 A, di/dT = 100 A/µs
36
55
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 73009
S-71660-Rev. B, 06-Aug-07