RV Datasheet, PDF (2/5 Pages) Vishay Siliconix – CECC ( ) 40401-010 Qualified Thin Film Chip Resistors

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RV
Vishay Sfernice
DIMENSIONS in millimeters (inches)
A
D
D
C
B
SERIES/
CASE SIZES
RV 0505
RV 0603
RV 0805
RV 1206
E
A
Min.
1.198
(0.047)
1.368
(0.054)
1.758
(0.069)
2.908
(0.114)
Max.
1.502
(0.059)
1.672
(0.066)
2.062
(0.081)
3.212
(0.126)
E
B
Min.
Max.
1.143
(0.045)
1.397
(0.055)
0.623
(0.025)
0.877
(0.035)
1.143
(0.045)
1.397
(0.055)
1.473
(0.058)
1.727
(0.068)
D/E
Min.
Max.
0.250
(0.010)
0.510
(0.020)
0.250
(0.010)
0.510
(0.020)
0.250
(0.010)
0.510
(0.020)
0.250
(0.010)
0.510
(0.020)
POPULAR OPTION
AEC-Q200 moisture resistance
Option to order: 0058: Specific production process to withstand 85 °C/85 % RH at Pn/10
C
Min.
Max.
0.373
(0.015)
0.627
(0.025)
0.373
(0.015)
0.627
(0.025)
0.373
(0.015)
0.627
(0.025)
0.373
(0.015)
0.627
(0.025)
ENVIRONMENTAL TEST
TEST
Overload
Climatic sequences ⁽¹⁾
Thermal shock ⁽¹⁾
Load life ⁽¹⁾
Resistance to solder heat
Moisture resistance ⁽¹⁾
High temperature storage
Bending ⁽¹⁾
CONDITIONS
6.25 x rated power / 2 s (or 2 UL)
-55 °C / +155 °C
5 moisture cycles
-55 °C / +155 °C
5 cycles 30 min
+70 °C/Pn
1000 h
+260 °C/ 10 s
+40 °C / 93 % HR
Pn / 10
AEC-Q200 ⁽³⁾
85 °C / 85 % RH / Pn / 10
1000 h
1000 h at + 155 °C
10 bends / 2 mm / 5 s
VALUES AND DRIFTS (R/R ± %)
CECC REQUIREMENTS TYPICAL PERFORMANCE
0.05 % Rn ⁽²⁾ + 0.05 
0.01 % Rn ⁽²⁾
0.1 % Rn ⁽²⁾ + 0.05 
0.02 % Rn ⁽²⁾
0.05 % Rn ⁽²⁾ + 0.05 
0.02 % Rn ⁽²⁾
0.1 % Rn ⁽²⁾ + 0.05 
0.05 % Rn ⁽²⁾ + 0.05 
0.1 % Rn ⁽²⁾ + 0.05 
0.05 % Rn ⁽²⁾
0.02 % Rn ⁽²⁾
0.01 % Rn ⁽²⁾
0.5 % + 0.05 
0.1 % Rn ⁽²⁾ + 0.05 
0.05 % Rn ⁽²⁾ + 0.05 
Max. < 0.3 % + 0.05 
0.05 % Rn ⁽²⁾
0.02 % Rn ⁽²⁾
SPECIFIC CONDITIONS DUE TO TERMINATION TYPE
TEST
CONDITIONS
B; G
N
VALUES AND DRIFTS
VISHAY REQUIREMENTS TYPICAL PERFORMANCE
Solderability
+235 °C/2 s
Sn60Pb40 alloy
+245 °C/3 s
Sn97Ag3 alloy
VISUAL INSPECTION
High T° reflow profile
N/A
+255 °C/40 s
(on parts)
0.02 % Rn ⁽²⁾ + 0.05 
0.01 % Rn ⁽²⁾ + 0.05 
Notes
(1) _{Test requiring parts to be mounted on PCB will be performed with the requirement that termination alloy will be the same as solder paste}
alloy. Gold termination will be tested as B termination
(2) _{Rn: Nominal Resistanceï€} 
Pn: Nominal Power
(3) _{Option to order: 0058}
Revision: 21-Jun-14
2
Document Number: 60022
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000