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HFA30PA60CPBF_11 Datasheet, PDF (2/8 Pages) Vishay Siliconix – HEXFRED Ultrafast Soft Recovery Diode, 2 x 15 A
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VS-HFA30PA60CPbF
Vishay Semiconductors
HEXFRED®
Ultrafast Soft Recovery Diode, 2 x 15 A
ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
Cathode to anode
breakdown voltage
VBR
IR = 100 µA
600
-
IF = 15 A
-
1.3
Maximum forward voltage
VFM
IF = 30 A
See fig. 1
-
1.5
IF = 15 A, TJ = 125 °C
-
1.2
Maximum reverse
leakage current
VR = VR rated
-
1.0
IRM
See fig. 2
TJ = 125 °C, VR = 0.8 x VR rated
-
400
Junction capacitance
CT
VR = 200 V
See fig. 3
-
25
Series inductance
LS
Measured lead to lead 5 mm from package body
-
12
MAX.
-
1.7
2.0
1.6
10
1000
50
-
UNITS
V
µA
pF
nH
DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
Reverse recovery time
See fig. 5, 10
trr
IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V
trr1
TJ = 25 °C
trr2
TJ = 125 °C
-
19
-
-
42
60
-
70
120
Peak recovery current
See fig. 6
Reverse recovery charge
See fig. 7
IRRM1
IRRM2
Qrr1
Qrr2
TJ = 25 °C
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
IF = 15 A
dIF/dt = 200 A/µs
VR = 200 V
-
4.0
6.0
-
6.5
10
-
80
180
-
220
600
Peak rate of fall of
recovery current during tb
See fig. 8
dI(rec)M/dt1
dI(rec)M/dt2
TJ = 25 °C
TJ = 125 °C
-
250
-
-
160
-
UNITS
ns
A
nC
A/µs
THERMAL-MECHANICAL SPECIFICATIONS PER LEG
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Junction to case,
single leg conduction
Junction to case,
both legs conducting
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
Tlead
0.063” from case (1.6 mm) for 10 s
RthJC
RthJA
RthCS
Typical socket mount
Mounting surface, flat, smooth and greased
Weight
Mounting torque
Marking device
Case style TO-247AC (JEDEC)
MIN.
-
-
-
-
-
-
-
6.0
(5.0)
TYP.
-
-
MAX.
300
1.7
UNITS
°C
-
0.85
K/W
-
40
0.25
-
6.0
-
0.21
-
12
-
(10)
HFA30PA60C
g
oz.
kgf · cm
(lbf · in)
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For technical questions within your region, please contact one of the following: Document Number: 94068
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Revision: 23-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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