HFA08TB60 Datasheet, PDF (2/6 Pages) International Rectifier – Ultrafast, Soft Recovery Diode

HFA08TB60
Vishay High Power Products
HEXFRED^®
Ultrafast Soft Recovery Diode, 8 A
ELECTRICAL SPECIFICATIONS (T_J = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
Cathode to anode
breakdown voltage
V_BR
I_R = 100 µA
600
I_F = 8.0 A
-
Maximum forward voltage
V_FM
I_F = 16 A
See fig. 1
-
I_F = 8.0 A, T_J = 125 °C
-
Maximum reverse
leakage current
I_RM
V_R = V_R rated
T_J = 125 °C, V_R = 0.8 x V_R rated
See fig. 2
-
-
Junction capacitance
C_T
V_R = 200 V
See fig. 3
-
Series inductance
L_S
Measured lead to lead 5 mm from package body
-
TYP.
-
1.4
1.7
1.4
0.3
100
10
8.0
MAX.
-
1.7
2.1
1.7
5.0
500
25
-
UNITS
V
µA
pF
nH
DYNAMIC RECOVERY CHARACTERISTICS (T_J = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
Reverse recovery time
t_rr
I_F = 1.0 A, dI_F/dt = 200 A/µs, V_R = 30 V
t_rr1
T_J = 25 °C
-
18
-
37
t_rr2
T_J = 125 °C
-
55
Peak recovery current
Reverse recovery charge
I_RRM1
I_RRM2
Q_rr1
Q_rr2
T_J = 25 °C
T_J = 125 °C
T_J = 25 °C
T_J = 125 °C
I_F = 8.0 A
dI_F/dt = 200 A/µs
V_R = 200 V
-
3.5
-
4.5
-
65
-
124
Peak rate of fall of recovery
current during t_b
dI_(rec)M/dt1
dI_(rec)M/dt2
T_J = 25 °C
T_J = 125 °C
-
240
-
210
MAX.
-
55
90
5.0
8.0
138
360
-
-
UNITS
ns
A
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Thermal resistance,
junction to case
T_lead
R_thJC
0.063" from case (1.6 mm) for 10 s
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
R_thJA
R_thCS
Typical socket mount
Mounting surface, flat, smooth and greased
Weight
Mounting torque
Marking device
Case style TO-220AC
MIN.
-
-
-
-
-
-
6.0
(5.0)
TYP.
-
-
MAX.
300
3.5
UNITS
°C
-
80
K/W
0.5
-
2.0
-
0.07
-
-
12
(10)
HFA08TB60
g
oz.
kgf · cm
(lbf · in)
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For technical questions, contact: [e-mail]
Document Number: 93044
Revision: 30-Jul-08