CHPFR Datasheet, PDF (2/7 Pages) Vishay Siliconix – ESCC ( ) 4001/026 Qualified R Failure RateHigh Precision Thick Film Chip Resistors

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CHPFR
Vishay Sfernice
CLIMATIC SPECIFICATIONS
Operating temperature range
-55 °C; +155 °C
Soldering temperature (T_sol)
Thick film (ruthenium oxyde)
TYPICAL HF PERFORMANCE OF HCHP
2.0
1Ω
1.8
1.6
10 Ω
1.4
1.2
100 Ω
1.0
200 Ω
0.8
0.6
1 kΩ
0.4
1 MΩ
100 kΩ
10 kΩ
0.2
0
1
10
Size 0603 (W/A)
100
1000
10 000
f (MHz)
POWER DERATING CURVE
100
80
60
40
20
0
0 20 40 60 70 80 100 120 140 155
Ambient Temperature in °C
MECHANICAL SPECIFICATIONS
Substrate
Alumina
Technology
Thick film (ruthenium oxyde)
Protection
Epoxy coating
Terminations
B (W/A): SnPb over nickel
barrier for solder reflow
G (W/A) type: Gold over nickel
barrier for gluing
PACKAGING
Waffle-pack or tape and reel when specified
NUMBER OF PIECES PER PACKAGE
SIZE
WAFFLE
PACK
2" x 2"
TAPE AND REEL ⁽¹⁾
MIN.
MAX.
0603
100
0805
1206
140
5000
4000
100
2010
60
2512
45
2000
Note
(1) _{MOQ for tape and reel: 50 pieces}
TAPE
WIDTH
8 mm
8 mm
SUGGEESTED LAND PATTERN (please refer to IPC-7351A)
G_min.
X_max.
CHIP SIZE
0603
0805
1206
2010
2512
Z_max.
2.38
2.77
3.91
5.94
7.21
Z_max.
G_min.
0.34
0.73
1.87
3.64
4.91
X_max.
0.98
1.40
1.73
2.67
3.32
Revision: 19-Nov-14
2
Document Number: 52033
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