140CLH_08 Datasheet, PDF (2/7 Pages) Vishay Siliconix – Aluminum Capacitors SMD (Chip), High Temperature

140 CLH
Vishay BCcomponents
Aluminum Capacitors
SMD (Chip), High Temperature
Table 1
DIMENSIONS in millimeters AND MASS
NOMINAL
CASE SIZE
LxWxH
8 x 8 x 10
10 x 10 x 10
10 x 10 x 14
CASE
CODE
0810
1010
1014
L_max.
8.5
10.5
10.5
W_max.
8.5
10.5
10.5
H_max.
10.5
10.5
14.3
ØD
8.0
10.0
10.0
0.4 ± 0.2
L
B_max.
S
1.0
3.1
1.0
4.5
1.0
4.5
D
WB
H
L_{1 max.}
9.9
11.8
11.8
MASS
(g)
≈ 1.0
≈ 1.3
≈ 1.5
CS C
0.3 max.
Fig.2 Dimensional outline
Table 2
TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES
NOMINAL
CASE SIZE
LxWxH
CASE
CODE
PITCH
P₁
TAPE WIDTH
W
TAPE THICKNESS
T₂
8 x 8 x 10
0810
16
24
11.3
10 x 10 x 10
1010
16
24
11.3
10 x 10 x 14
1014
16
24
14.8
Note
1. Detailed tape dimensions see section “PACKAGING”.
REEL DIA.
380
380
330
PACKAGING
QUANTITY
PER REEL
500
500
250
MOUNTING
The capacitors are designed for automatic placement on to
b
printed-circuit boards.
Optimum dimensions of soldering pads depend amongst
others on soldering method, mounting accuracy, print lay-out
and/or adjacent components.
For recommended soldering pad dimensions, refer to Fig.3
and Table 3.
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
soldering pad during processing.
For maximum conditions refer to Fig.4.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
Table 3
RECOMMENDED SOLDERING PAD
DIMENSIONS in millimeters
CASE CODE
a
b
c
0810
3.5
2.5
3.0
1010
4.3
2.5
4.0
1014
4.3
2.5
4.0
a
c
a
Fig. 3 Recommended solder pad dimensions
AS A GENERAL PRINCIPLE, TEMPERATURE AND
DURATION SHALL BE THE MINIMUM NECESSARY
REQUIRED TO ENSURE GOOD SOLDERING
CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM
CURVES SHOULD NEVER BE EXCEEDED.
T_Pad ²⁸⁰
(°C) ₂₆₀
240
220
200
180
160
140
120
100
80
0
50
100
150
200 t (s) 250
Fig. 4 Maximum temperature load during infrared reflow
soldering measured on the soldering pad
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Document Number: 28303
Revision: 29-May-08