593D105X9035B2TE3 Datasheet, PDF (17/18 Pages) Vishay Siliconix – Solid Tantalum Surface Mount Chip Capacitors TANTAMOUNT®, Molded Case, Low ESR

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Typical Performance Characteristics
Vishay Sprague
CAPACITOR ENVIRONMENTAL CHARACTERISTICS
ITEM
CONDITION
Humidity tests
At 40 °C/90 % RH 1000 h, no voltage applied.
Temperature cycles
At -55 °C/+125 °C, 30 min each, for 5 cycles.
Moisture resistance
Thermal shock
MIL-STD-202, method 106 at rated voltage,
42 cycles.
Capacitors are subjected to 5 cycles of the
following:
-55 °C (+0 °C, -5 °C) for 30 min, then
+25 °C (+10 °C, -5 °C) for 5 min, then
+125 °C (+3 °C, -0 °C) for 30 min, then
+25 °C (+10 °C, -5 °C) for 5 min
ENVIRONMENTAL CHARACTERISTICS
Capacitance change
Cap.  600 μF
Cap. > 600 μF
Dissipation factor

Within ± 10 % of initial value
Within ± 20 % of initial value
Not to exceed 150 % of initial 
+25 °C requirement
Capacitance change
Cap.  600 μF
Cap. > 600 μF
Dissipation factor
Leakage current

Within ± 10 % of initial value
Within ± 20 % of initial value
Initial specified value or less
Initial specified value or less
Capacitance change
Cap.  600 μF
Cap. > 600 μF
Dissipation factor
Leakage current

Within ± 10 % of initial value
Within ± 20 % of initial value
Initial specified value or less
Initial specified value or less
Capacitance change
Cap.  600 μF
Cap. > 600 μF
Dissipation factor
Leakage current

Within ± 10 % of initial value
Within ± 20 % of initial value
Initial specified value or less
Initial specified value or less
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION
CONDITION
Shear test
Apply a pressure load of 5 N for 10 s ± 1 s
horizontally to the center of capacitor side body.
Substrate bend
Vibration
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 3 mm, for a total of 3 bends at a rate of 1 mm/s.
MIL-STD-202, method 204, condition D, 10 Hz to
2000 Hz, 20 g peak
Shock
MIL-STD-202, method 213B shock (specified
pulse), condition I, 100 g peak
Resistance to solder heat
Solderability
• Recommended reflow profiles temperatures
and durations are located within the Capacitor
Series Guides
• Pb-free and lead-bearing series caps are
backward and forward compatible
MIL-STD-2002, method 208, ANSI/J-STD-002,
test B. Applies only to solder and tin plated
terminations.
Does not apply to gold terminations.
Resistance to solvents
MIL-STD-202, method 215
Flammability
Encapsulent materials meet UL 94 V-0 with an
oxygen index of 32 %.
POST TEST PERFORMANCE
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Revision: 03-Feb-14
3
Document Number: 40088
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