PR02000203000JR500 Datasheet, PDF (13/16 Pages) Vishay Siliconix – Power Metal Film Leaded Resistors

PR01/02/03
Vishay BCcomponents ^{Power Metal Film Leaded Resistors}
10 ²
Z
R
10
1
R_n = 1.5 Ω
R_n = 18 Ω
R_n = 1.3 kΩ
10 ^-1
Rn = 20 kΩ
10 ^-2
1
Application Information
R_n = 100 kΩ
10
10 ²
f (MHz)
10 ³
PR03 Impedance as a function of applied frequency
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with
IEC 60115-1 specification, category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days).
The tests are carried out in accordance with IEC 60068-2-xx
Test Method under standard atmospheric conditions
according to IEC 60068-1, 5.3.
In the Test Procedures and Requirements table, tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods. A
short description of the test procedure is also given. In some
instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2-
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.4.1
Visual examination
No holes; clean surface; no damage
4.4.2
Dimensions (outline)
Gauge (mm)
See Straight and Kinked Dimensions tables
Applied voltage (+ 0 %/- 10 %):
R < 10 Ω: 0.1 V
10 Ω ≤ R < 100 Ω: 0.3 V
4.5
Resistance
(refer note on first
page for measuring
distance)
100 Ω ≤ R < 1 kΩ: 1 V
1 kΩ ≤ R < 10 kΩ: 3 V
R - R_nom: max. ± 5 %
10 kΩ ≤ R < 100 kΩ: 10 V
100 kΩ ≤ R < 1 MΩ: 25 V
R = 1 MΩ: 50 V
4.18
20 (Tb)
Resistance to
soldering heat
Thermal shock: 10 s; 260 °C; 3 mm from body
ΔR max.: ± (1 % R + 0.05 Ω)
4.29
45 (Xa)
Component solvent
resistance
Isopropyl alcohol or H₂O
followed by brushing
No visual damage
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122
For technical questions, contact: [e-mail]
Document Number: 28729
Revision: 14-Oct-09