PR02000203000JR500 Datasheet, PDF (11/16 Pages) Vishay Siliconix – Power Metal Film Leaded Resistors

PR01/02/03
Vishay BCcomponents ^{Power Metal Film Leaded Resistors}
100
∆T
(K)
80
60
40
15 mm
20 mm
25 mm
200
∆T
(K)
160
120
80
20
40
0
0
0.8
1.6 _{P (W)} 2.4
Ø 0.8 mm FeCu-leads
Minimum distance from resistor body to PCB = 1 mm
PR02 Temperature rise (ΔT) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
100
∆T
(K)
80
15 mm
20 mm
60
25 mm
40
20
0
0
1
2 _{P (W)} 3
Ø 0.8 mm Cu-leads
Minimum distance from resistor body to PCB = 1 mm
PR03 Temperature rise (ΔT) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
100
∆T
(K)
80
10 mm
60
15 mm
20 mm
40
25 mm
20
0
0
1
Ø 0.8 mm Cu-leads
2 _{P (W)} 3
PR03 Hot-spot temperature rise (ΔT) as a function
of dissipated power.
240
∆T
(K)
200
160
120
80
40
0
0
1
Ø 0.6 mm FeCu-leads
2 _{P (W)} 3
PR03 Hot-spot temperature rise (ΔT) as a function
of dissipated power.
240
∆T
(K)
200
160
120
80
40
0
0
1
2 _{P (W)} 3
Ø 0.6 mm FeCu-leads
Minimum distance from resistor body to PCB = 1 mm
PR03 Temperature rise (ΔT) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
Application Information
0
0
1
Ø 0.8 mm FeCu-leads
2 _{P (W)} 3
PR03 Hot-spot temperature rise (ΔT) as a function
of dissipated power.
www.vishay.com
120
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Document Number: 28729
Revision: 14-Oct-09