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VS-VSKEU300 Datasheet, PDF (1/6 Pages) Vishay Siliconix – High surge capability
www.vishay.com
VS-VSKEU300/12PbF
Vishay Semiconductors
HEXFRED® Ultrafast Diodes, 300 A
(INT-A-PAK Power Modules)
INT-A-PAK
PRODUCT SUMMARY
VR
VF (typical) at 300 A at 25 °C
trr (typical) at 45 A
IF(DC) at TC
Package
Circuit
1200 V
2.18 V
233 ns
300 A at 60 °C
INT-A-PAK
Single diode
FEATURES
• Electrically isolated: DCB base plate
• Standard JEDEC® package
• Simplified mechanical designs, rapid assembly
• High surge capability
• Large creepage distances
• Case style INT-A-PAK
• Designed and qualified for industrial level
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
REMARKS
• Product reliability results valid for TJ = 150 °C
• Recommended operation temperature Top = 150 °C
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Cathode to anode voltage
VR
Continuous forward current
IF
Single pulse forward current
IFSM
Maximum power dissipation
PD
RMS isolation voltage
Junction temperature range
Storage temperature range
VISOL
TJ
TStg
TEST CONDITIONS
TC = 25 °C
TC = 60 °C
TJ = 25 °C
TC = 25 °C
TC = 60 °C
50 Hz, circuit to base, all terminal shorted, t = 1 s
VALUES
1200
375
300
2400
1040
750
3500
-40 to +150
-40 to +150
UNITS
V
A
W
V
°C
ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
Cathode to anode breakdown voltage
VBR
Maximum forward voltage
VFM
IR = 500 μA
IF = 300 A
IF = 300 A, TJ = 150 °C
1200
-
-
2.18
-
2.24
Maximum reverse leakage current
VR = 1200 V
IRM
TJ = 150 °C, VR = 1200 V
-
0.06
-
-
MAX.
-
2.23
2.47
0.2
20
UNITS
V
mA
Revision: 02-Dec-15
1
Document Number: 94670
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000