VS-FCSP0530ETR Datasheet, PDF (1/6 Pages) Vishay Siliconix – Supplied tested and on tape and reel

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FlipKY^®
PRODUCT SUMMARY
I_F(AV)
V_R
V_F at I_F
I_RM max. at 25 °C
I_RM max. at 125 °C
T_J max.
E_AS
VS-FCSP0530ETR
Vishay Semiconductors
FlipKY^®, 0.5 A
FEATURES
• Ultralow V_F to footprint area
• Very low profile (< 0.6 mm)
• Low thermal resistance
• Supplied tested and on tape and reel
• Designed for consumer level
APPLICATIONS
• Reverse polarity protection
• Current steering
• Freewheeling
• Flyback
• Oring
0.5 A
30 V
0.33 V
50 μA
15 mA
150 °C
5 mJ
DESCRIPTION
FlipKY^® product family utilizes wafer level chip scale
packaging to deliver Schottky diodes with the lowest
V_F to PCB footprint area in the industry. The three
pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and
occupy only 1.08 mm² of board space. The anode and
cathode connections are made through solder bump pads
on one side of the silicon rather than through protruding
leads enabling designers to strategically place the diodes on
the PCB. This design not only minimizes board space but
also reduces thermal resistance and inductance, which can
improve overall circuit efficiency.
Typical applications include hand-held, portable equipment
such as cell phones, MP3 players, PDAs, and portable hard
disk drives where space savings and performance are
crucial.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
I_F(AV)
Rectangular waveform
V_RRM
I_FSM
t_p = 5 μs sine
V_F
0.5 A_pk, T_J = 125 °C
T_J
Range
VALUES
0.5
30
190
0.33
- 55 to 150
UNITS
A
V
A
V
°C
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
V_R
V_RWM
VS-FCSP0530ETR
30
UNITS
V
Revision: 04-Jul-11
1
Document Number: 93429
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000