TH4 Datasheet, PDF (1/15 Pages) Vishay Siliconix – Operating temperature up to 175°C with 50% voltage derating

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TH4
Vishay Sprague
Solid Tantalum Surface Mount Chip Capacitors
TANTAMOUNT™ Molded Case, HI-TMP^®
High Temperature 175 °C, Automotive Grade
PERFORMANCE / ELECTRICAL
CHARACTERISTICS
www.vishay.com/doc?40215
Operating Temperature: -55 °C to +175 °C
Capacitance Range: 10 μF to 100 μF
Capacitance Tolerance: ± 10 %, ± 20 %
Voltage Range: 6.3 V_DC to 35 V_DC
FEATURES
• Operating temperature up to 175 °C with 50 %
voltage derating
• AEC-Q200 qualified
• 100 % surge current tested
• RoHS-compliant terminations available:
matte tin (all cases), gold (D case)
• Standard EIA 535BAAC case sizes
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Automotive
• Industrial
• High temperature
ORDERING INFORMATION
TH4
C
226
TYPE
CASE
CODE
CAPACITANCE
K
CAPACITANCE
TOLERANCE
016
DC VOLTAGE
RATING AT +85 °C
C
TERMINATION AND
PACKAGING
1000
ESR
See
Ratings
and Case
Codes
table
This is expressed in
picofarads. The first
two digits are the
significant figures.
The third is the
number of zeros to
follow.
K = ± 10 %
M = ± 20 %
This is expressed in V.
To complete the
three-digit block, zeros
precede the voltage
rating. A decimal point
is indicated by an “R”
(6R3 = 6.3 V)
Matte tin
C = 7" (178 mm) reel
D = 13" (330 mm) reel
V = 7" (178 mm) reel,
dry pack
U = 13" (330 mm) reel,
dry pack
Maximum
100 kHz ESR
0500 = 500 m
5000 = 5.0 
10R0 = 10.0 
Notes
• We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. Voltage
substitutions will be marked with the higher voltage rating.
• Dry pack as specified in J-STD-033 for MSL3. Applicable for D and E cases only.
DIMENSIONS in inches [millimeters]
L
T_H (MIN.)
Glue Pad
H
W
T_W
Glue Pad
P
CASE CODE
EIA SIZE
L
W
H
P
B
3528-21
0.138 ± 0.008 0.110 ± 0.008 0.075 ± 0.008 0.031 ± 0.012
[3.5 ± 0.20]
[2.8 ± 0.20]
[1.9 ± 0.20]
[0.80 ± 0.30]
C
6032-28
0.236 ± 0.012 0.126 ± 0.012 0.098 ± 0.012 0.051 ± 0.012
[6.0 ± 0.30]
[3.2 ± 0.30]
[2.5 ± 0.30]
[1.3 ± 0.30]
D
7343-31
0.287 ± 0.012 0.169 ± 0.012 0.110 ± 0.012 0.051 ± 0.012
[7.3 ± 0.30]
[4.3 ± 0.30]
[2.8 ± 0.30]
[1.3 ± 0.30]
E
7343-43
0.287 ± 0.012 0.169 ± 0.012 0.157 ± 0.012 0.051 ± 0.012
[7.3 ± 0.30]
[4.3 ± 0.30]
[4.0 ± 0.30]
[1.3 ± 0.30]
Note
• Glue pad (non-conductive, part of molded case) is dedicated for glue attachment (as user option).
T_W
0.087 ± 0.004
[2.2 ± 0.10]
0.087 ± 0.004
[2.2 ± 0.10]
0.094 ± 0.004
[2.4 ± 0.10]
0.094 ± 0.004
[2.4 ± 0.10]
T_H (MIN.)
0.028
[0.70]
0.039
[1.0]
0.039
[1.0]
0.039
[1.0]
Revision: 06-Dec-16
1
Document Number: 40152
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000