SQJ940EP_15 Datasheet, PDF (1/15 Pages) Vishay Siliconix – Automotive Dual N-Channel 40 V (D-S) 175 °C MOSFETs

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SQJ940EP
Vishay Siliconix
Automotive Dual N-Channel 40 V (D-S) 175 °C MOSFETs
PRODUCT SUMMARY
N-CHANNEL 1 N-CHANNEL 2
V_DS (V)
R_DS(on) () at V_GS = 10 V
R_DS(on) () at V_GS = 4.5 V
I_D (A)
Configuration
40
40
0.0160
0.0064
0.0188
0.0076
15
18
Dual N
FEATURES
• TrenchFET^® Power MOSFET
• AEC-Q101 Qualified^d
• 100 % R_g and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
PowerPAK^® SO-8L Asymmetric
6.15mm
4
G2
3
S2
2
G1
5.13mm
D2
D1
1
S₁
Bottom View
D₁
D₂
G₁
G₂
S₁
N-Channel 1 MOSFET
S₂
N-Channel 2 MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
PowerPAK SO-8L Dual Asymmetric
SQJ940EP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T_C = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL N-CHANNEL 1 N-CHANNEL 2
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current^a
Continuous Source Current (Diode Conduction)^a
Pulsed Drain Current^b
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation^b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{e, f}
T_C = 25 °C
T_C = 125 °C
L = 0.1 mH
T_C = 25 °C
T_C = 125 °C
V_DS
V_GS
I_D
I_S
I_DM
I_AS
E_AS
P_D
T_J, T_stg
40
40
± 20
15
18
15
10.5
15
39
60
72
20.5
35.5
21
63
48
43
16
14
- 55 to + 175
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
N-CHANNEL 1 N-CHANNEL 2
UNIT
Junction-to-Ambient
Junction-to-Case (Drain)
PCB Mount^c
R_thJA
70
R_thJC
3.3
70
°C/W
3.5
Notes
a. Package limited.
b. Pulse test; pulse width  300 μs, duty cycle  2 %.
c. When mounted on 1" square PCB (FR4 material).
d. Parametric verification ongoing.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S13-0567-Rev. A, 18-Mar-13
1
Document Number: 62767
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000