SISS10DN Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 40 V (D-S) MOSFET

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SiSS10DN
Vishay Siliconix
N-Channel 40 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
40
R_DS(on) () (MAX.)
0.00265 at V_GS = 10 V
0.00360 at V_GS = 4.5 V
I_D (A) ^{a, g}
60
60
Q_g (TYP.)
23 nC
PowerPAK^® 1212-8S _D
D
D
6
D
7
8
5
3.3 _mm
1
Top View
3.3 ^mm
1
4
3
S
2
S
S
G
Bottom View
Ordering Information:
SiSS10DN-T1-GE3 (lead (Pb)-free and halogen-free)
FEATURES
• TrenchFET^® Gen IV power MOSFET
• Optimized Q_g, Q_gd, and Q_gd/Q_gs ratio
reduces switching related power loss
• 100 % R_g and UIS tested
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Synchronous rectification
• High power density DC/DC
• VRMs and embedded DC/DC
• Synchronous buck converter
• Load switching
• Battery management
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
T_C = 25 °C
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
Pulsed Drain Current (t = 100 μs)
I_DM
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
T_J, T_stg
LIMIT
40
+20, -16
60 ^g
60 ^g
31.7 ^{b, c}
25 ^{b, c}
150
51.8
4.3 ^{b, c}
30
45
57
36
4.8 ^{b, c}
3 ^{b, c}
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
Steady State
SYMBOL
R_thJA
R_thJC
TYPICAL
21
1.7
MAXIMUM
26
2.2
UNIT
°C/W
Notes
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
g. Package limited.
S16-0219-Rev. A, 08-Feb-16
1
Document Number: 65439
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000