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| SISB46DN Datasheet, PDF (1/13 Pages) Vishay Siliconix – Dual N-Channel 40 V (D-S) MOSFET | |||
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www.vishay.com
SiSB46DN
Vishay Siliconix
Dual N-Channel 40 V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
40
RDS(on) (ï) MAX.
0.01171 at VGS = 10 V
0.01580 at VGS = 4.5 V
ID (A) f
34
29.4
Qg (TYP.)
6.8 nC
PowerPAK® 1212-8 Dual
D2
D2
6
D1
7
D1
8
5
3.3 mm
1
Top View
3.3 mm
1
4
G2
3
S2
2
G1
S1
Bottom View
Ordering Information:ï
SiSB46DN-T1-GE3 (lead (Pb)-free and halogen-free)
FEATURES
⢠TrenchFET® Gen IV power MOSFET
⢠Tuned for the lowest RDS - Qoss FOM
⢠100 % Rg and UIS tested
⢠Qgd / Qgs ratio < 1 optimizes switching characteristics
⢠Material categorization:ï
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
⢠Synchronous rectification
⢠DC/DC converters
⢠Motor drive switch
⢠Battery and load switch
D1
D2
G1
G2
S1
N-Channel MOSFET
S2
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
TC = 25 °C
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
TA = 70 °C
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
TC = 25 °C
TA = 25 °C
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
TC = 25 °C
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) c, d
VDS
VGS
ID
IDM
IS
IAS
EAS
PD
TJ, Tstg
LIMIT
40
+20 / -16
34
27.3
11.4 a, b
9.2 a, b
70
19
2.2 a, b
11
6
23
14.8
2.6 a, b
1.7 a, b
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient a, e
t ï£ 10 s
RthJA
38
Maximum Junction-to-Case (Drain)
Steady state
RthJC
4.3
48
°C/W
5.4
Notes
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 94 °C/W.
f. Based on TC = 25 °C.
S16-1524-Rev. A, 08-Aug-16
1
Document Number: 76655
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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