SIS890DN Datasheet, PDF (1/13 Pages) Vishay Siliconix – N-Channel 100 V (D-S) MOSFET

N-Channel 100 V (D-S) MOSFET
SiS890DN
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
100
R_DS(on) () (Max.)
0.0235 at V_GS = 10 V
0.0245 at V_GS = 7.5 V
0.0315 at V_GS = 4.5 V
I_D (A)^f
30^g
30^g
28.5
Q_g (Typ.)
9.5 nC
PowerPAK^® 1212-8
3.30 mm
S
1
S
3.30 mm
2
S
3
G
4
D
8
D
7
D
6
D
5
Bottom View
Ordering Information:
SiS890DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Capable of Operating with 5 V Gate Drive
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Telecom Bricks
D
• Primary side switch
• Synchronous Rectification
• Industrial
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
100
V
V_GS
± 20
T_C = 25 °C
30^g
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
26.5
8.8^{a, b}
T_A = 70 °C
7.1^{a, b}
A
Pulsed Drain Current (t = 300 µs)
I_DM
60
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
30^g
3.1^{a, b}
Single Pulse Avalanche Current
L = 0.1 mH
I_AS
10
Single Pulse Avalanche Energy
E_AS
5
mJ
T_C = 25 °C
52
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
33
3.7^{a, b}
W
T_A = 70 °C
2.4^{a, b}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{c, d}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{a, e}
t  10 s
R_thJA
26
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
1.9
33
°C/W
2.4
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 81 °C/W.
f. Based on T_C = 25 °C.
g. Package limited.
Document Number: 63867
For technical questions, contact: [e-mail]
www.vishay.com
S12-0973-Rev. A, 30-Apr-12
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000