SIR788DP Datasheet, PDF (1/13 Pages) Vishay Telefunken – N-Channel 30 V (D-S) MOSFET with Schottky Diode

New Product
SiR788DP
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) () Max.
0.0034 at V_GS = 10 V
0.0043 at V_GS = 4.5 V
I_D (A)^a
60
60
Q_g (Typ.)
24 nC
PowerPAK^® SO-8
6.15 mm
D
8
D
7
D
6
D
5
S
1
S
5.15 mm
2
S
3
G
4
Bottom View
Ordering Information:
SiR788DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• SkyFET^® Monolithic TrenchFET^® Gen III
Power MOSFET and Schottky Diode
• 100 % R_g Tested
• 100 % Avalanche Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Synchronous Buck Converter
D
• DC/DC
Schottky
G
Diode
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
± 20
T_C = 25 °C
60^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
60^a
28.6^{b, c}
Pulsed Drain Current (t = 300 µs)
T_A = 70 °C
22.8^{b, c}
A
I_DM
100
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
60^a
5.6^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L =0.1 mH
I_AS
E_AS
25
31
mJ
T_C = 25 °C
48
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
31
5.0^{b, c}
W
T_A = 70 °C
3.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
20
Steady State
R_thJC
2.1
25
°C/W
2.6
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
Document Number: 63659
For technical support, please contact: [e-mail]
www.vishay.com
S12-0808-Rev. A, 16-Apr-12
1
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000