SIR403EDP Datasheet, PDF (1/13 Pages) Vishay Siliconix – P-Channel 30 V (D-S) MOSFET

New Product
P-Channel 30 V (D-S) MOSFET
SiR403EDP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.0065 at V_GS = - 10 V
- 30
0.0082 at V_GS = - 6 V
0.0115 at V_GS = - 4.5 V
I_Da, ^e
- 40
- 40
- 40
Q_g (Typ.)
66 nC
PowerPAK^® SO-8
6.15 mm
S
1
S
5.15 mm
2
S
3
G
4
D
8
D
7
D
6
D
5
Ordering Information:
Bottom View
SiR403EDP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Extended V_GS range (± 25 V) for adaptor switch
applications
• Extremely low R_DS(on)
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Typical ESD Performance: 4000 V (HBM)
• Material categorization: For definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
• Adaptor Switch, Load Switch
S
• Power Management
• Notebook Computers and Portable
Battery Packs
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 30
V
V_GS
± 25
T_C = 25 °C
- 40^e
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 40^e
- 21.9^b,c
T_A = 70 °C
- 17.5^b,c
A
Pulsed Drain Current (t = 300 µs)
I_DM
- 60
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
- 40^e
- 4.2^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
- 40
80
mJ
T_C = 25 °C
56.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
36.4
5^b,c
W
T_A = 70 °C
3.2^b,c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^f,g
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, d}
t  10 s
R_thJA
20
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
1.7
25
°C/W
2.2
Notes:
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under steady state conditions is 68 °C/W.
e. Package Limited
f. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
g. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 66744
For technical questions, contact: [e-mail]
www.vishay.com
S13-0302-Rev. A, 11-Feb-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000