SIJA52DP Datasheet, PDF (1/10 Pages) Vishay Siliconix – N-Channel 40 V (D-S) MOSFET

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SiJA52DP
Vishay Siliconix
N-Channel 40 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
40
R_DS(on) () Max.
0.0017 at V_GS = 10 V
0.0023 at V_GS = 4.5 V
I_D (A) ^{a, g}
60
60
PowerPAK^® SO-8L Single
Q_g (Typ.)
47.5 nC
D
6.15 _mm
1
5.13 ^mm
1
2^S
3^S
4^S
G
Top View
Bottom View
Ordering Information: 
SiJA52DP-T1-GE3 (lead (Pb)-free and halogen-free)
FEATURES
• TrenchFET^® Gen IV power MOSFET
• Tuned for the lowest R_DS-Q_oss FOM
• 100 % R_g and UIS tested
• Q_gd / Q_gs ratio < 1 optimizes switching
characteristics
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
D
• Synchronous rectification
• ORing
• High power density DC/DC
• VRMs and embedded DC/DC
G
• DC/AC inverters
• Load switch
N-Channel MOSFET
S
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
40
V
V_GS
+20, -16
T_C = 25 °C
60 ^g
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
60 ^g
39.6 ^{b, c}
Pulsed Drain Current (t = 100 μs)
T_A = 70 °C
31.3 ^{b, c}
A
I_DM
150
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
56.8
4.3 ^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
35
E_AS
61
mJ
T_C = 25 °C
48
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
30.7
4.8 ^{b, c}
W
T_A = 70 °C
3 ^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
T_J, T_stg
-55 to +150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
22
Steady State
R_thJC
1.7
26
°C/W
2.6
Notes
a. T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
g. Package limited.
S16-0749-Rev. A, 25-Apr-16
1
Document Number: 67387
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000