SIJ494DP Datasheet, PDF (1/7 Pages) Vishay Siliconix – N-Channel 150 V (D-S) MOSFET

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SiJ494DP
Vishay Siliconix
N-Channel 150 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
150
R_DS(on) () Max.
0.0232 at V_GS = 10 V
0.0272 at V_GS = 7.5 V
I_D (A) ^a
36.8
34
PowerPAK^® SO-8L Single
Q_g (Typ.)
16.1 nC
FEATURES
• ThunderFET^® technology optimizes balance of
R_DS(on), Q_g, Q_sw and Q_oss
• 100 % R_g and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
D
6.15 _mm
1
5.13 ^mm
1
2^S
3^S
4^S
G
Top View
Bottom View
Ordering Information:
SiJ494DP-T1-GE3 (lead (Pb)-free and halogen-free)
APPLICATIONS
• Primary side switching
• Synchronous rectification
• DC/AC inverters
• LED backlighting
• High current switching
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
150
V
V_GS
± 20
T_C = 25 °C
36.8
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
29.5
9.8 ^{b, c}
Pulsed Drain Current (t = 100 μs)
T_A = 70 °C
7.9 ^{b, c}
A
I_DM
100
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
36.8
4.5 ^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
30
E_AS
45
mJ
T_C = 25 °C
69.4
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
44.4
5 ^{b, c}
W
T_A = 70 °C
3.2 ^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
T_J, T_stg
-55 to +150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
20
Steady State
R_thJC
1.3
25
°C/W
1.8
Notes
a. T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
S16-1734-Rev. A, 29-Aug-16
1
Document Number: 79056
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000