SIB914DK Datasheet, PDF (1/9 Pages) Vishay Siliconix – Dual N-Channel 1.2-V (G-S) MOSFET

New Product
SiB914DK
Vishay Siliconix
Dual N-Channel 1.2-V (G-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.113 at V_GS = 4.5 V
0.138 at V_GS = 2.5 V
8
0.190 at V_GS = 1.8 V
0.280 at V_GS = 1.5 V
0.480 at V_GS = 1.2 V
PowerPAK SC75-6L-Dual
1
S1
D₁
D₁
6
G₂
5
1.60 mm S₂
4
2
G₁
D2
3
D₂
1.60 mm
I_D (A)^g
1.5^a
1.5^a
1.5^a
1.0
0.3
Q_g (Typ.)
1.5 nC
FEATURES
• Halogen-free
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-75 Package
- Small Footprint Area
- Low On-Resistance
RoHS
COMPLIANT
APPLICATIONS
• Load Switch, PA Switch and Battery Switch for Portable
Devices
• DC/DC Converter
D₁
D₂
Marking Code
Part # code
CBX
XXX
Lot Traceability
and Date code
G₁
G₂
S₁
S₂
Ordering Information: SiB914DK-T1-GE3 (Lead (Pb)-free and Halogen-free) N-Channel MOSFET
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
8
V
V_GS
±5
T_C = 25 °C
1.5^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
1.5^a
1.5^{a, b, c}
T_A = 70 °C
1.5^{a, b, c}
A
Pulsed Drain Current
I_DM
6
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
1.5^a
0.9^{b, c}
T_C = 25 °C
3.1
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
2.0
1.1^{b, c}
W
T_A = 70 °C
0.7^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
90
Steady State
R_thJC
32
115
°C/W
40
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 125 °C/W.
g. Based on T_C = 25 °C.
Document Number: 68792
S-81946-Rev. A, 25-Aug-08
www.vishay.com
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